PCB中英文对照词汇.docx

1、PCB中英文对照词汇PCB中英文对照词汇一、综合词汇序号中文英文1印刷电路Printed circuit2印制线路Printed wiring3印刷板Printed board4印制板电路Printed circuit board(pcb)5印制线路板Printed wiring board(pwb)6印制元件Printed component7印制接点Printed contact8印制板装配Printed board assembly9板board10单面印制板Single-sided printed board(ssb)11双面印制板Double-sided printed board(

2、dsb)12多层印制板Multilayer printed board(mlb)13多层印制电路板Multilayer printed circuit board14多层印制线路板Multilayer printed wiring board15刚性印制板Rigid printed board16刚性单面印制板Rigid single-sided printed board17刚性双面印制板Rigid double-sided printed board18刚性多层印制板Rigid multilayer printed board19挠性多层印制板Flexible multilayer pri

3、nted board20挠性印制板Flexible printed board21挠性单面印制板Flexible single-sided printed board22挠性双面印制板Flexible double-sided printed board23挠性印制电路Flexible printed circuit(fpc)24挠性印制线路Flexible printed wiring25刚性印制线路Flex-rigid printed board、rigid-flex printed board26刚性双面印制板Flex-rigid double-sided printed board、r

4、igid-flex double-sided printed27刚性多层印制板Flex-rigid multilayer printed board、rigid-flex double-sided printed28齐平印制板Flush printed board29金属芯印制板Metal core printed board30金属基印制板Metal base printed board31多重布线印制板Mulit-wiring printed board32陶瓷印制板Ceramic substrate printed board33导电胶印制板Electroconductive paste

5、 printed board34模塑电路板Molded circuit board35模压印制板Stamped printed wiring board 36顺序层压多层印制板Sequentially-laminated multilayer37散线印制板Discrete wiring board38微线印制板Micro wire board39积层印制板Build-up printed board40积层多层印板Build-up multilayer printed board (bum)41积层挠性印制板Build-up flexible printed board42表面层合电路板Sur

6、face laminar circuit(slc)43埋入凸块连印制板B2it printed board44多层膜基板Mutil-layered film substrate(mfs)45层间全内导通多层印制板Alivh multiplayer printed board46载芯片板Chip on board (cob)47埋电阻板Buried resistance board48母板Mother board49子板Daughter board50背板backplane51裸板Bare board52键盘板夹心板Copper-invar-copper board53动态挠性板Dynamic

7、flex board54静态挠性板Static flex board55可断拼板Break-away planel56电缆cable57挠性扁平电缆Flexible flat cable (ffc)58薄膜开关Membrance switch59混合开关Hybrid circuit60厚膜Thick film61厚膜电路Thick film circuit62薄膜Thin film63薄膜混合电路Thin film hybrid circuit64互连interconnection65导线Conductor trace line66齐平导线Flush conductor67传输线Transmi

8、ssion line68跨交crossover69板边插头Edge-board contact70增强板stiffener71基底Substrate72基板面Real estate73导线面Conductor side74元件面Component side75焊接面Solder side76印制Printing77网格Grid78图形Pattern79导电图形Conductive pattern80非导电图形Non-conductive pattern81字符legend82标志mark二、基材序号中文英文1基材Base material2层压板Laminate3覆金属箔基材Metal-cla

9、d bade material4覆铜箔层压板Copper-clad laminate(ccl)5单面覆铜箔层压板Single-sided copper-clad laminate6双面覆铜箔层压板Double-sided copper laminate7复合层压板Composite laminate8薄层压板Thin laminate9金属芯覆铜箔层压板Metal core copper-clad laminate10金属基覆铜层压板Metal base copper-clad laminate11挠性覆铜箔绝缘薄膜Flexible copper-clad dielectric film12基

10、体材料Basis material13预浸材料Prepreg14粘结片Bonding sheet15预浸粘结片Preimpregnated bonding sheet16环氧玻璃基板Epoxy glass substrate17加成法用层压板Laminate for additive process18预制内层覆箔板Mass laminate panel19内层芯板Core material20催化板材Catalyzed board 21涂胶催化层压板Adhesive-coated catalyzed laminate22涂胶无催化层压板Adhesive-coated uncatalyzed

11、laminate23粘结层Bonding layer24粘结膜Film adhesive25涂胶粘剂绝缘薄膜Adhesive coated dielectric film26无支撑胶粘剂膜Unsupported adhesive film27覆盖层Cover layer28增强板材Stiffener material29铜箔面Copper-clad surface30去铜箔面Foil removal surface31层压板面Unclad laminate surface32基膜面Base film surface33胶粘剂面Adhesive face34原始光洁面Plate finish35

12、粗面Matt finish36纵向Length wise direction37横向Cross wise direction38剪切板Cut to size panel39酚醛纸质覆铜箔板Phenolic cellulose paper copper-clad laminates(phenolic paper ccl)40环氧纸质覆铜箔板Epoxide cellulose paper copper-clad laminates(epoxy paper ccl)41环氧玻璃布基覆铜箔板Epoxide woven glass fabric copper-clad laminate42环氧玻璃布纸复

13、合覆铜箔板Epoxide cellulose paper core glass cloth surfaces copper-clad laminate43环氧玻璃布玻璃纤维复合覆铜箔板Epoxide non woven glass reinforced copper-clad laminate44聚酯玻璃布覆铜箔板Polyester woven glass fabric copper-clad laminate45聚酰亚胺玻璃布覆铜箔板Polyimide woven glass fabric copper-clad laminate46双马来酰亚胺三嗪环氧玻璃布覆铜板Bismaleimide

14、triazine epoxide woven glass fabric copper-clad laminate47环氧合成纤维布覆铜箔板Epoxide synthetic fiber copper-clad laminates48聚四乙烯玻璃纤维覆铜箔板Teflon fiber glass copper-clad laminate49超薄型层压板Ultra thin laminate50陶瓷基覆铜箔板Ceramincs base copper-clad laminate51紫外线阻挡型覆铜箔板Uv blocking copper-clad laminates三、基材的材料序号中文英文1a阶树

15、脂a-stage resin2b阶树脂b-stage resin3c阶树脂c-stage resin4环氧树脂Epoxy resin5酚醛树脂Phenolic resin6聚酯树脂Polyester resin7聚酰亚胺树脂Polyimide resin8双马来酰亚胺三嗪树脂Bismaleimide-triazine resin9丙烯酸树脂Acrylic resin10三聚氰胺甲醛树脂Melamine formaldehyde resin11多功能环氧树脂Polyfunctional epoxy resin12溴化环氧树脂Brominated epoxy resin13环氧酚醛Epoxy no

16、volac14氟树脂fluroresin15硅树脂Silicone resin16硅烷silane17聚合物polymer18无定形聚合物Amorphous polymer19结晶现象Crystalline polamer20双晶现象dimorphism21共聚物copolymer22合成树脂synthetic23热固性树脂Thermosetting resin24热塑性树脂Thermoplastic resin 25感光性树脂Photosensitive resin26环氧当量Weight per epoxy equipvalent(wpe)27环氧值Epoxy value28双氰胺dicy

17、andiamide29粘结剂binder30固化剂Curing agent31胶粘剂adesive32阻燃剂Flame retardant33遮光剂opaquer34增塑剂plasticizers35不饱和聚酯Unsatuiated polyster36聚酯薄膜polyester37聚酰亚胺薄膜Polyimide film(pi)38聚四氟乙烯Polytetrafluoetylene(ptfe)39聚四氟乙烯丙烯薄膜Perfluorinated ethylene-propylene copolymer film(fep)40增强材料Reinforcing material41玻璃纤维Glass

18、 fiber42E玻璃纤维e-glass fiber43D玻璃纤维d-glass fiber44S玻璃纤维s-glass fiber45玻璃布Glass fabric46非织布Non-woven fabric47玻璃纤维垫Glass mats48纱线yarn49单丝filament50胶股strand51纬纱Weft yarn52经纱Warp yarn53但尼尔denier54经向Warp-wise55纬向Weft-wise、filling-wise56织物经纬密度Thread count57织物组织Weave structure58平纹组织Plain structure59坏布Grey fa

19、bric60稀松织物Woven scrim61弓纬Bow of weave62断经End missing63缺纬Mis-picks64纬斜bias65折痕crease66云织waviness67鱼眼Fish eye68毛圈长Feather length69厚薄段mark70裂缝spilt71捻度Twist of yarn72浸润剂含量Size content73浸润剂残留量Size residue74处理剂含量Finish leval75浸润剂size76偶联剂Couplint agent77处理织物Finished fabric 78聚酰胺纤维Polyarmide fiber79聚酯纤维非织

20、布Non-woven polyester fabric80浸渍绝缘纵纸Impregenating insulation paper81聚芳酰胺纤维纸Aromatic polyamide paper82断裂长Breaking length83吸水高度Height of capillary rise84湿强度保留率Wet strength retention85白度whitenness86陶瓷ceramics87导电箔Conductive foil88铜箔Copper foil89电解铜箔Electrodeposited copper foil (ed copper foil)90压延铜箔Roll

21、ed copper foil91退火铜箔Annealed copper foil92压延退火铜箔Rolled annealed copper foil (ra copper foil)93薄铜箔Thin copper foil94涂胶铜箔Adhesive coated foil95涂胶脂铜箔Resin coated copper foil(rcc)96复合金属箔Composite metallic material97载体搏Carrier foil98殷瓦invar99箔（剖面）轮廓Foil profile100光面Shiny side101粗糙面Matte side102处理面Treated

22、 side103防锈处理Stain proofing104双面处理铜箔Double treated foil四、设计序号中文英文1原理图Shematic diagram2逻辑图Logic diagram3印制线路布设Printed wire layout4布设总图Master drawing5可制造性设计Design-for-manufacturability6计算机辅助设计Computer-aided design(cad)7计算机辅助制造Computer-aided manufacturability(cim)8计算机集成制造Computer integrat manufacturing9

23、计算机辅助工程Computer-aided engineering(cae)10计算机辅助测试Computer-aided test (cat)11电子设计自动化Electric design automaton(eda)12工程设计自动化Engineering design automaton(eda2)13组装设计自动化Assemnly aided architectural design(aaad)14计算机辅助制图Computer aided drawing15计算机控制显示Computer controlled display(ccd)16布局placement17布线routing

24、18布图设计layout19重布rerouting20模拟simulation21逻辑模拟Logic simulation22电路模拟Circit simulate23时序模拟Timing simulation24模块化modularization25布线完成率Layout effeciency26机器描述格式Machine descriptionm format(mdf)27机器描述格式数据库Mdf database28设计数据库Design database29设计原点Design origin30优化（设计）Optimization(design)31供设计优化坐标轴Predominan

25、t axis32表格原点Table origin33镜像Mirroring34驱动文件Drive file35中间文件Intermediate file36制造文件Manufacturing documentation37队列支撑数据库Queue support database38元件安置component positioning39图形显示Graphics display40比例因子Scaling factor41扫描填充Scan filling42矩形填充Rectangle filling43填充域Region filling44实体设计Physical design45逻辑设计Logi

26、c design46逻辑电路Logic design47层次设计Hierarchical design48自顶向下设计Top-down design49 自顶向上设计Bottom-up design 50线网net51数字化digitzing52设计规则检查Design rule checking 53走（布）线路Router(cad)54网络表Net list55计算机辅助电路分析Computer-aided circuit analysis56子线网Subnet57目标函数Objective function58设计后处理Post design processing(pdp)59交互式制图设计Interactive drawing design60费用矩阵Cost metrix61工程图Engineering drawing62方块框图Block diagram63迷宫Moze64元件密度Component density65巡回售货员问题Traveling salesman problem66自由度Degrees freedom67入度Out going degree68出度Incoming degree69曼哈顿距离Manhatto