PCB工程英文.docx

1、PCB工程英文工 程 英 文 确 认 常 用 词 及 常 用 语 句 汇 总厚度公差线路层孔层阻焊层字符层外形层叠层单词1. 附件：attached 2. 样品：sample3. 承认：approval4. 答复：answer;reply5. 规格：spec6. 与.同样的：the same as 7. 前版本：previous version(old version)8. 生产：production9. 确认：confirm10. 再次确认：double confirm11. 工程问题：engineering query（EQ）12. 尽快：ASAP(as soon as possible)

2、13. 生产文件：production gerber14. 联系某人：contact somebody15. 提交样板：submit sample16. 交货期：delivery date17. 电测成本：ET（electrical test） cost18. 通断测试：Open and short testing19. 参考：refer to20. IPC标准：IPC standard21. IPC二级：IPC class 222. 可接受的：acceptable23. 允许：permit24. 制造：manufacture25. 修改：revision26. 公差：tolerance27.

3、 忽略：ignore(omit)28. 工具孔：tooling hole29. 安装孔：mounting hole30. 元件孔：component hole31. 槽孔：slot32. 邮票孔：snap off hole33. 导通孔：via34. 盲孔： blind via35. 埋孔：buried via36. 金属化孔：PTH(plating through hole)37. 非金属化孔：NPTH( no plating through hole)38. 孔位：hole location39. 避免：avoid40. 原设计：original design41. 修改：modify42

4、. 按原设计：leave it as it is43. 附边：waste tab44. 铜条：copper strip45. 拼板强度：panel strong46. 板厚：board thickness47. 删除：remove(delete)48. 削铜：shave the copper49. 露铜：copper exposure50. 光标点：fiducial mark51. 不同：be different from(differ from)52. 内弧：inside radius53. 焊环：annular ring54. 单板尺寸：single size55. 拼板尺寸：panel

5、size56. 铣：routing57. 铣刀：router58. V-cut：scoring59. 哑光：matt60. 光亮的：glossy61. 锡珠：solder ball(solder plugs)62. 阻焊：solder mask(solder resist)63. 阻焊开窗：solder mask opening64. 单面开窗：single side mask opening65. 补油：touch up solder mask66. 补线：track welds67. 毛刺：burrs68. 去毛刺：deburr69. 镀层厚度：plating thickness70. 清

6、洁度：cleanliness71. 离子污染：ionic contamination72. 阻燃性：flammability retardant73. 黑化：black oxidation74. 棕化：brown oxidation75. 红化：red oxidation76. 可焊性：solderability77. 焊料：solder78. 包装：packaging79. 角标：corner mark80. 特性阻抗：characteristic impedance81. 正像：positive82. 负片：negative83. 镜像：mirror84. 线宽：conductor wid

7、th85. 线距：conductor spacing86. 做样：build sample87. 按照：as per88. 成品：finished89. 做变更：make the change90. 相类似：similar to91. 规格：specification92. 下移：shift down93. 垂直地：vertically94. 水平的：horizontally95. 增大：increase96. 缩小：decrease97. 表面处理：Surface Finishing98. 波峰焊：wave solder99. 钻孔数据：drilling date100. 标记：Logo10

8、1. Ul 标记：Ul Marking102. 蚀刻标记：etched marking103. 周期：date code104. 翘曲：bow and twist105. 外层：outer layer106. 内层：internal layer107. 顶层：top layer108. 底层：bottom layer109. 元件面：component side110. 焊接面：solder side111. 阻焊层：solder mask layer112. 丝印层：legend layer (silkscreen layer or over layer)113. 兰胶层：peelable

9、SM layer114. 贴片层：paste mask layer115. 碳油层：carbon layer116. 外形层：outline layer(profile layer)117. 白油：white ink118. 绿油：green ink119. 喷锡：hot air leveling (HAL)120. 水金：flash gold121. 插头镀金：plated gold edge-board contacts122. 金手指：Gold-finger123. 防氧化：Entek(OSP)124. 沉金：Immersion gold (chem. Gold)125. 沉锡：Imme

10、rsion Tin(chem.Tin)126. 沉银：Immersion Silver (chem. silver)127. 单面板：single sided board128. 双面板：double sided board129. 多层板：multilayer board130. 刚性板：rigid board131. 挠性板：flexible board132. 刚挠板：flex-rigid board133. 铣：CNC (mill , routing)134. 冲：punching135. 倒角：beveling 136. 倒斜角：chamfer137. 倒圆角：fillet138.

11、尺寸：dimension139. 材料：material140. 介电常数：Dielectric constant141. 菲林：film142. 成像：Imaging143. 板镀：Panel Plating144. 图镀：Pattern Plating145. 后清洗：Final Cleaning146. 叠层：layup (stack-up)147. 污染焊盘：contaminate pad148. 分孔图：drill chart149. 度数：degree150. 被覆盖：be covered with151. 负公差：minus tolerance152. 标靶盘： target p

12、ad153. 外形公差：routing tolerance154. 芯板：core常用语句、厚度1. 要求孔内铜厚0.001太紧对我们的生产，建议按IPC二级0.0008。The copper thickness of the wall of the plated-through holes is specified 0.001. Its too tight for our production. We suggest as per IPC class 2.thats to say ,Its 0.0008 .2.要求金手指镀金厚度为1.2-1.5um，我们加工太困难，建议按我们常规0.45um

13、。The plating thickness of Au in edge contact is specified 1.2-1.5um,it is too tough for us, we suggest following our normal standard ,that is to say 0.45um instead.3.建议所要求的铜厚2OZ为成品铜厚，而且我们将用基铜1.5OZ电镀到2OZ。The copper thickness is specified 2OZ .We suggest the finished copper thickness 2OZ. And we will

14、use the base material with 1.5OZ copper thickness and plate to 2OZ for our production. 4.要求锡厚为0.0005-0.003，我们做不到这么厚，建议按IPC二级，即保证可焊性，The solder thickness is required to plated 0.0005-0.003 ,We can not reach the requirement .We suggest following IPC class 2 for the solder thickness and we will assure

15、the solderability. 二、公差1. XXX.的尺寸公差为+/-0.005，这要求是太紧对我们生产，建议公差放松到+/-0.008。The tolerance of dimension is specified XXX.+/-0.005 .It is tight for our production .We suggest +/-0.008 instead。2.在*.pdf文件中要求外形公差为+/-0.005，建议按IPC 二级+/-0.01代替。The profile tolerance is specified +/-0.005 in *.pdf file. We sugge

16、st as per IPC class 2，that is to say, it is +/-0.01.3. 在叠层图中要求板厚公差为+/-0.007，而notes 1中要求板厚公差为+/-0.005，他们是不同的，建议0.062+/-0.007是可接受的，因为+/-0.005对我们来说太难控制了。The tolerance of the board thickness is specified +/-0.007 in layup detail which is different form NOTES 1 +/-0.005.We suggest 0.062+/-0.007 is accept

17、able for +/-0.005 is very tough for us to control.4.外形公差要求+/-0.1mm，这超出了我们生产，建议按+/-0.2mm控制。The tolerance of the outline is specified +/-0.1mm.Its above us.We suggest +/-0.2mm instead.5. v-cut留厚公差为+/-0.06mm上下偏移公差为+/-0.05mm，这两个公差都太紧，建议两个公差都按+/-0.1mm控制。The remain tolerance of v-cut is specified +/-0.06m

18、m and offset tolerance is +/-0.05mm. they are too tight for us,we suggest both tolerance are +/-0.1mm instead.6.孔位公差为0.05mm，这是太紧对我们，建议用+/-0.076mm替代。The tolerance of the hole position is specified 0.05mm. Its too tight for us, We suggest +/-0.076mm instead.7. 角度公差为+/-0.5mm，这是太紧对我们，v-cut角度我们将控制在30+/-5

19、度。The tolerance of angle is +/-0.5 degree ,it is tight for us , we would like to control the angle of v-cut within 30+/-5 degree.8.在1MB5476-01.pdf文件中要求孔到板中心的公差是+/-0.05mm，这是太紧对我们，建议安IPC二级。It is special that the tolerance of the hole to board center is +/-0.05mm in the 1MB5476-01.pdf file,it is too ti

20、ght for us ,we suggest as per IPC class 2 .9.要求线宽和线间距公差为+/-0.03，这是太紧对我们，请确认放松到+/-20%。It stated that conductor width and spacing shall be within +/-0.03(0.001) of gerber data , it is tight for us , we would like to relax to +/-20%.Pls confirm.10.3.0的孔径公差要求+0.05mm，这太紧对我们，请确认放松到+0.1/-0mm。The tolerance

21、of the holes with diameter 3.0mm is required to control within +0.05mm ,it is tight for us , we would like to relax to +0.1/-0mm.Pls confirm.三、线路层1.两个孔到外形很近，这将引起露铜和破孔，建议允许露铜与破孔。Two holes are near the outline,it will cause copper exposed and hole broken,we suggest copper exposed and hole broken is pe

22、rmitable.2.有些盘离外形很近，建议削铜皮0.4mm，避免露铜。Some pads are close to the outline .We suggest shaving the pads about 0.4mm avoid to the copper exposure.3. 焊盘延伸出板外，如按原设计，板边将会露铜，建议允许露铜。The copper pad extend to the board outline, it will lead to copper exposed if we follow Gerber to do,We suggest copper exposed i

23、s acceptable.4.有三个盘离v-cut 线很近将会引起露铜，建议削焊盘0.4mm避免露铜。The three pads are so close to the v-cut that they will cause copper exposure. We suggest shaving the pads 0.4mm avoid to the copper exposure.5.底层有些地方线路网格间距仅有0.178mm，这种网格间距我们生产无法做到，建议减小线宽使间距达到0.2mm.The copper grids on bottom side is only 0.178mm in

24、some places,we can not do it per this gap,so we suggest decreasing the tracewidth to make copper grids to 0.2mm.6. 既然没有功能上的影响，我们建议所有层附边均加些铜皮以提高电镀质量。We suggest putting some extra copper on the waste tab in all layers to improve plating quality since this is no function effect.7.建议加在顶层空白区域加些铜以提高电镀质量。W

25、e suggest putting some copper in blank area on top side to improve plated quality.8.我们发现有两处铜皮间距仅有0.013mm，建议把它们连接起来。We have found that the gap between two block copper is only 0.013mm on bottom side,we suggest they are connected.9. 两个光标点处在v-cut线上，它们将被削到，我们建议向左边移1.0mm。The two fiducial marks are over v

26、-groove line . They will be cut . We suggest moving them 1.0mm toward the left . 四、孔层1. 两个直径2.0MM的孔，4个直径4.0MM的孔，4个直径1.3MM的孔双面没有焊盘，但它们被定义成PTH孔，我们建议做NPTH孔The 2 holes with dia.2.0mm , 4 holes with dia.4.0mm and 4 holes with dia.1.3mm have no pads on top and bottom copper layer .But they are specified P

27、TH in drill chart. We suggest build them as NPTH.2这些孔（直径1.4MM，1.6mm,1.8mm,2.5mm）被定义成PTH孔，但它们的焊盘与孔径等大，我们建议做NPTH孔。These holes (1.4mm ,1.6mm,1.8mm,2.5mm)are specified PTH .But they have pads which are the same as the holes in copper layer .We suggest them NPTH.3.六个直径0.25MM的孔在分孔图中定义为NPTH孔，但它们的线路焊盘比孔大，我们

28、建议做PTH孔。The 6 holes with dia.0.25mm are specified NPTH in drill chart .But they have pads which are larger than the holes in copper layers .We sugget them PTH .4. 直径0.11“的孔对应的焊盘比孔大，但它们被定义成NPTH孔，我们建议沿孔边削铜皮0.3MM ，请确认The hole with dia.0.11 have pad which is larger than the hole in top and bottom copper

29、 layer .But its specified NPTH.we suggest shaving the pads 0.3mm around the hole.Pls confirm.5.GERBER中孔的类型没有定义，2个直径0.120“的孔双面没有焊盘，我们想确认这2个直径0.120”的孔为NPTH孔。The hole type(PTH or NPTH) did not be define in the Gerber, the two holes of diameter 0.120 inch have not copper pads on both sides, we would lik

30、e to confirm the two holes of diameter 0.120 inch are non-plating holes, please confirm .6.一些1.5mm的孔靠得非常近，建议把他们制成槽孔。Some holes with dia.1.5mm are very close each other, we suggest doing them oval hole.7.有两个0.991、0.762重叠在一起，建议保留一个0.991mm的孔。There are two holes with dia.0.991 mm and dia.0.762 mm overla

31、p each other in one place,we suggest only dia.0.991mm remain there.8.在DRD孔表中直径0.012英寸孔数是291，而在钻孔文件中孔数是290，请确认孔数是290而不是291。The quantity of diameter 0.012 inch in the hole chart of file DRD is 291, but(thruhole,tap) it is only 290. please confirm the quantity of diameter 0.012 inch holes in the drill flie should be 290 not 291.9.在孔表中标明1.7*1.9mm的槽数量为4个，但gerber中仅有两个，建议按gerber制作。In the drilldraw file,it stated that the quantity of slots 1.7*1.9mm is 4 ,but we have found two slo