MI设计规范Word文档下载推荐.docx

1、内容Contents对应页码Page5.1 材料选配Material choose2-3厚度计算Thickness calculate 2 Coverlay胶厚选择Adhesive thickness of coverlay choose 厂内自配胶基本原则Matching principle of adhesive by the company材料选配Material choose 35.2 流程定义Manufacturing process3-7基本流程定义Main process3-5 流程注意事项定义Notes to pay attention5-75.3 资料图纸制作Drawing

2、making7-11流程单备注内容Notes in MI7-8 图纸资料制作Drawing information making8-11 5.4 检查项目 Check item附件一MI Checklist六.内容 Contents 6.1 材料选配 Material choose 6.1.1 厚度计算 Thickness calculate 6.1.1.1 FPC厚度公差 0.03mm（Min 0.02mm）; The thickness tolerance of FPC is 0.02mm）. 6.1.1.2 FPCPI补强厚度公差0.05mm（Min 0.03mm）; The thick

3、ness tolerance of FPC and PI stiffener is 0.03mm）. 6.1.1.3 FPCFR4补强厚度公差0.1mm; The thickness tolerance of FPC and FR4 is 0.1mm. 6.1.1.4 FPC钢片补强厚度公差 The thickness tolerance of FPC and steel sheet is 6.1.1.5 FPC背胶厚度公差0.05mm; The thickness tolerance of FPC and tape is 0.05mm. 6.1.1.6 厚度计算须考虑镀铜厚度，计算时取值单面

4、镀铜厚0.6mil； Take the thickness of copper plating into account when calculate, and choose the single plating thickness of 0.6mil.6.1.1.7 厚度计算时，Coverlay须扣除溢胶厚度，溢胶量依其胶厚的40%计算； Deduct the resin thickness （40% of the adhesive thickness） of coverlay when calculate. 6.1.1.8 背胶厚度为不包括离形纸厚； The tape thickness

5、doesnt include the thickness of release paper. 6.1.2 基材搭配Coverlay之基本原则 Principle of main material match coverlay6.1.2.1 单面板1/3 oZ & 1/2 oZ 铜基材，Coverlay AD厚度可选择0.6mil & 1mil； Single-side 1/3 oZ & 1/2 oZ copper match Coverlay AD 0.6mil & 1mil;6.1.2.2 双面板1/3 oZ & 1/2 oZ 铜基材，Coverlay AD厚度可选择 1mil； Doubl

6、e-side 1/3 oZ & 1/2 oZ copper match Coverlay AD 1mil; 6.1.2.3 单,双面板1 oZ 铜基材，Coverlay AD厚度可选择 1mil&1.4mil； Single and double-side 1 oZ copper matches Coverlay AD 1mil&1.4mil; 6.1.3 厂内自配胶基本原则 Matching principle of adhesive by the company6.1.3.1 FR4配胶是将胶布于FR4上； FR4: Gelatinize on the FR4.6.1.3.2 PET配胶通

7、常为感压胶； PET: choose the pressure sensitive adhesive.6.1.3.3 自配PI补强选材原则；纯PI带胶PI纯胶，不可使用两种带胶PI直接叠成； PI stiffener: pure PI + PI with adhesive + pure adhesive, not to choose two PI with adhesive at the same time.6.1.4 材料选配基本原则 Principle of material choose6.1.4.1 压合板接着使用之纯胶应尽量使用1mil之厚度； Choose the adhesive

8、 thickness of 1 mil for laminate board.6.1.4.2 有动态绕折或屈曲要求之FPC必须使用RA铜； Choose RA copper for flexible board. 6.1.4.3 线宽线距小于4mil，基材尽量使用薄铜，1/2 oZ或1/3 oZ铜基材； Choose the thin copper of 1/2 oZ or 1/3 oZ for the L/W & L/S under 4 mil. 6.1.4.4 无特殊指定情况下，插拔手指背面补强配PI补强； Choose PI stiffener on bottom of the inse

9、rt finger unless specified.6.1.4.5 无特殊指定情况下，Connector背面补强配FR4补强； Choose FR4 stiffener on bottom of the Connector unless specified. 6.1.4.6 无特殊指定情况下，BGA背面补强配钢片补强； Choose STEEL SHEET on bottom of the BGA unless specified. 6.1.4.7 副材贴合后需过SMT高温焊接之FPC，胶系的使用须考虑是否耐高温； Choose the hot resist adhesive if it n

10、eeds SMT after tacking. 6.1.4.8 钢片补强有接地要求（电阻1欧姆），建议采用CBF-300热固胶膜+SUS304NST钢片； Choose the CBF-300 thermal setting adhesive + SUS304NST steel sheet if the steel sheet needs to link to earth. 6.1.4.9 银箔目前有两种规格，SF-PC5000（22um,黑色）, SF-PC1000（32um,白色），均可做为防电磁波使用； There are 2 types of silver foil recently:

11、 SF-PC5000（22um, black）, SF-PC1000（32um, white）, of all are anti-electromagnetic wave. 6.1.4.10单面板不可整面印曝光显影型油墨制作，易卷曲； Not to choose the LPI for whole panel print of single side board. 6.1.4.11 基材搭配Coverlay尽量选用同一供应商； Choose the same supplier of the copper and coverlay at one time.6.2 流程定义 Definition

12、of Manufacturing Process 6.2.1 基本流程定义（只定义出流程中的大站） Definition of Main process 6.2.1.1 单面板基本流程 Single-side 开料 - 钻孔 - 曝光显影 - 蚀刻脱膜 - 贴Coverlay - 压制固化 - 打孔- 网印文字 - 电,化金 - 加工贴补强 - 冲型 - 电测 - 外形冲型 - 成检 -入库 Shearing drilling exposing and developing etching and striping coverlay tacking laminating and solidif

13、ying target punching silk screen Ni/Gold plating or Ni/Gold immersion stiffener tacking punching electrical testing outline punching FQC - warehouse 6.2.1.2 纯铜板基本流程 Pure copper foil 开料 - 钻孔 - 假贴Base - 压制固化 - 曝光显影 - 蚀刻脱膜 - 假贴Coverlay - 压制固化 - 打孔- 网印文字 - 电,化金 - 加工贴补强 - 冲型 - 电测 - 外形冲型 - 成检 -入库 Shearing

14、 drilling base coverlay tacking laminating and solidifying exposing and developing etching and striping top side coverlay tacking laminating and solidifying target punching silk screen - Ni/Gold plating or Ni/Gold immersion - stiffener tacking punching electrical testing outline punching FQC - wareh

15、ouse 6.2.1.3 双面板基本流程 Double-side 开料 - 钻孔 - 沉电铜 - 曝光显影 - 蚀刻脱膜 - 假贴Coverlay - 压制固化 - 打孔 - 网印文字 - 电,化金 - 加工贴补强 - 冲型 - 电测 - 外形冲型 - 成检 -入库 Shearing drilling copper plating or immersion - exposing and developing etching and striping coverlay tacking laminating and solidifying target punching silk screen N

16、i/Gold plating or Ni/Gold immersion stiffener tacking punching electrical testing outline punching FQC - warehouse6.2.1.4 压合板基本流程 Laminate board 开料 - 一次钻孔 - 基材压合 - 二次钻孔 - 沉电铜 - 曝光显影 - 蚀刻脱膜 - 假贴Coverlay - 压制固化 - 打孔 - 网印文字 - 电,化金 - 加工贴补强 - 冲型 - 电测 - 外形冲型 - 成检 -入库 Shearing first drilling base film tack

17、ing second drilling - copper plating or immersion - exposing and developing etching and striping coverlay tacking laminating and solidifying target punching silk screen Ni/Gold plating or Ni/Gold immersion stiffener tacking punching electrical testing outline punching FQC - warehouse6.2.1.5 四层分层板基本流

18、程 4-layer board 开料 - 一次钻孔 - 内层基材压合 - 二次钻孔（内层菲林对位孔）- 内层线路曝光显影 - 内层线路蚀刻脱膜 - 电测线检 - 内层Coverlay假贴 - 压制固化 - 四层基材压合 - 打孔（三钻定位孔） - 三次钻孔 - 等离子处理 - 沉电铜 - 外层线路曝光显影 - 外层线路蚀刻脱膜 - 电测线检 - 外层Coverlay假贴 - 压制固化 - 打孔 - 网印文字 - 电,化金 - 加工贴补强 - 冲型 - 电测 - 外形冲型 - 成检 -入库 Shearing first drilling inner base film tacking secon

19、d drilling （inner film registration） exposing and developing of inner layer etching and striping of inner layer electrical testing of inner layer coverlay tacking of inner layer laminating and solidifying 4-layer base film tacking punching （registration tooling） third drilling plasma copper plating

20、or immersion exposing and developing of outer layer etching and striping of outer layer electrical testing coverlay tacking of outer layer laminating and solidifying target punching silk screen - Ni/Gold plating or Ni/Gold immersion stiffener tacking punching electrical testing outline punching FQC

21、- warehouse6.2.1.6 以上基本流程在Coverlay压制固化前是不可更改，Coverlay压制固化后可根据具体情况适当调整流程 It cannot be change the process before coverlay tacking, and can be adjusted depends to actual condition for the processes after coverlay tacking.6.2.2 流程注意事项定义 Notes to pay attention6.2.2.1 辅助流程定义Definition of assistant process

22、 6.2.2.1.1 干膜贴合前使用：化学清洗； Before dry film tacking: chemical treatment. 6.2.2.1.2 双面板脱膜后进假贴前：双面磨板处理；单面板毋须； Before coverlay pre-laminate except single-side: brushing treatment of both sides. 6.2.2.1.3 黄油丝印前使用：磨板处理； Before yellow ink printing: brushing treatment. 6.2.2.1.4 表面处理前使用：表面处理喷沙； Before surface

23、 treatment: sand spraying. 6.2.2.1.5 热固胶系补强贴合前：板面檫乙醇； Before stiffener tacking of thermal setting adhesive: wipe the surface with alcohol. 6.2.2.1.6 BGA板于FQC前: 碱性除油； Before FQC of BGA: alkali degreasing.6.2.2.2 流程注意事项 Notes to pay attention 6.2.2.2.1 同时需要电镀NiAu和化学NiAu两种表面处理流程时，采取先化学NiAu，后电镀NiAu，即先高温

24、后低温原则； Put the Ni-Au immersion before the Ni-Au plating when take use of the two processes at the same time. 6.2.2.2.2 同时需要“金”和“锡”两种表面处理时，采取先“金”和“锡”； Put the gold plating before Tin plating when takes use of the gold and tin plating at the same time. 6.2.2.2.3 导电银箔或银浆须放置于电镀后制作； Put the electric silv

25、er foil or silver paste after the plating process. 6.2.2.2.4 需同时贴银箔和印银浆之FPC，须先贴银箔再印银浆； Put the silver foil tacking before silver paste printing when take use of the two processes at the same time.6.2.2.2.5 网印文字须排于化金之后； Put the silk screen after the gold plating process.6.2.2.2.6 OSP流程须排于电测后，且为整板过OSP

26、； Put the OSP process （whole panel） after electrical testing process.6.2.2.2.7 打孔流程尽量排于Coverlay压制固化后； Put the punching after the coverlay tacking process.6.2.2.2.8 针对双面板LPI制作；Double-side LPI productiona 单面开窗阻焊，但需双面印刷黄油时流程：印刷油墨（无阻焊开窗面）预烘 印刷油墨（有阻焊开窗面） 预烘 曝光 后流程 Single side solder mask open and double-

27、side yellow ink printing: ink printing （no open） pre baks ink printing （with open） pre baking exposing - b 双面开窗阻焊时流程：正面印刷油墨预烘 曝光 显影 固化 化学清洗 反面印刷油墨 预烘 曝光 后流程 Double-side open: ink printing of top side pre baking exposing developing solidifying chemical treatment ink printing of bottom side pre baking

28、 exposing - 6.2.2.2.10 针对PI补强的贴合与压制；PI stiffener tacking and laminating a 3mil及以下PI补强，流程: Coverlay假贴后 PI补强假贴 一起压制固化； 3mil and under 3 mil: coverlay tacking PI stiffener tacking laminating and solidifying together. b 3mil以上PI补强，不可与Coverlay一起压制固化，须单独压制固化; Above 3 mil: laminating and solidifying separa

29、tely.6.2.2.2.11 钢片补强尽量于外形冲型后，单PCS贴合； Tack the steel sheet piece by piece after outline punching.6.2.2.2.12 当钢片于外型冲型前贴合时时流程：穴拔冲型（钢片贴合处） 贴钢片 外形冲型（模具须将钢片处挖开）；Tack before outline punching: punching steel sheet tacking outlines punching.6.2.2.2.13 0.2mm FR4可条贴后与FPC一起成型； Rout together with FPC for the FR4 less than 0