专业英语.docx

1、专业英语Printed Circuit Board Fabrication Seminar印制板制造技术研讨1 Basic PCB Construction & Terminology基础PCB制造术语和名词2 Quotations引文3 Front End Engineering前后工程处理i) PAR (Produceability Analysis Review)PAR可制作性评审ii) Product Engineering工程制作iii) CAM(Computer Aided Manufacturing) 计算机辅助制造iv) Photoplotting 光绘4 Manufactur

2、ing Process 制作过程i) lnner Layer 内层 ii) Multilayer 层压iii) NC Drilling数控钻床iv) Electroless Copper 化学沉铜v) Outer Layer lmaging外光成像vi) Wet Processes湿法流程vii) Soldermask阻焊viii) Solderable Finishes(HASL & Alternatives)表面涂覆（热风整平或其他可以选择Tab Gold Plating镀金手指ix) Idents字符x) NC Routing数控铣外形xi) QCInspectionQC检查 5 Fre

3、quently Asked Questions常见问题i) Solderability可焊性ii) Ionic Cleanliness离子污染度iii) Controlled impedance阻抗控制iv) Blind & Buried Vias盲埋孔6 PCB SpecificationsPCB规范7 Future TechnologiesPCB未来发展技术i)Microvia第一部分 Basic PCB Construction & Terminology 基本PCB构造和技术Basic Multilayer Foil Build多层板叠合结构Copper Foil铜箔 Prepreg半

4、固化片Core芯片Prepreg半固化片Core芯片Prepreg半固化片Example：Foil Build - 6 layer board样板：6层板结构Basic PCB Construction Materials制造原料Laminates (cores,C-Stage)铜箔（芯板、C阶段）fully cured fiberglass-resin system完全胶连的玻璃树脂系统copper clad铜箔identified by core thickness,copper weight鉴别芯片厚度、铜箔重量“Prepregs”(B-stage)半固化片（B阶段）Pre-impreg

5、nated Bonding Layers提前注入连接层Partially cured fiberglass-resin system部分胶连的玻璃布树脂系统identified by glass type根据玻璃布类型鉴别Copper Foils铜箔Electrodeposited(ED)Std & DSTE电解铜或压延铜过程1Oz = 0.0014”Key Factors关键因素Grain Direction晶粒方向Scaling Factors缩放比例因素Single Source VendorsSample LaminatesLaminate覆铜板样板Nominal实际尺寸Toleran

6、ce公差Construction结构Dk介电常数0.00250.0025/0.000710804.280.00500.0055/0.0010106/23134.400.00500.0062/0.00101080/23134.500.00800.0085/0.00152313/21164.430.00950.0097/0.00152*21164.430.01200.0124/0.00151080/7628/10804.550.02100.0215/0.00253*76284.750.02800.0287/0.00254*76284.750.04700.0470/0.00507*76284.80P

7、art Numbering编号含义Natural color自然颜色pits &dents class凸点级别Flame retardant阻燃剂thickenss tolerance class厚度公差级别Glass reinforcement玻璃布加强warp &twist class弯曲和扭曲级别GFN0620C1/C1B2XThickness of laminate copper foil type(top/bottom)铜箔类型（顶层）板料厚度copper foil thickness (top/bottom)铜箔厚度（顶层）Sample prepregs半固化片样品Glass St

8、yle类型Pressed Thickness厚度Resin Content树脂含量DK介电常数1060.002074%4.0010800.002565%4.2821160.004555%4.4876280.007043%4.702113/23130.003557%4.40Alternative Resin Systems-Properties不同类型树脂系统及特性Resin System树脂系统Tg(degC)玻璃转化温度Dk介电常数X/y CTEZ CTE(-40 - 125C)Z CTE(50 200C)Comments备注N4000-2Multifunctional Epoxy(FR4)

9、多功能环氧树脂1404.412-1630 - 40170 - 190Most common最普通N4000-6Multifunctional Epoxy(FR4)多功能环氧树脂1804.410-1425 35160 170Better,thema,electrical,cherrical pmparticsl r更好的热、电、化学的性质N4000-6TThenmovnt Epoxy热敏环氧树脂1803.98-1225 35160 170Lowest x/y CTE. Taser abletable,N4000-13Multifunctional Epoxy(FR4)多功能环氧树脂2003.91

10、0-14N5000Bismale mide Tria Zine(BT) Epoxy1804.110-1425 - 35140 - 160N7000-1Polyimide2504.312-15N7000-2Toughened Polyimide2204.39-13N8000Cyanate Ester2503.811-13Alternative Resin Systems Fabrication Parameters不同类型的树脂系统及生产参数Resin System树脂系统Drill Hits钻孔数量Drill Stack叠数Desmear除胶Press Cycle压板周期N4000-2Mult

11、ifunctional Epoxy(00.FR4)多功能环氧树脂2 - 3K3 - 4Permanganate45minB4000-6Multifunctional Epoxy(FR4)多功能环氧树脂1 - 2K2 - 3Permanganate90minN4000-6TThenmovnt Epoxy热敏环氧树脂2 - 4K2 - 4Permanganate90minN4000-13Multifunctional Epoxy(FR4)多功能环氧树脂1 1.5K1 - 2Permanganate120minN5000Bismale mide Tria Zine(BT) Epoxy1 - 2K1

12、- 2Plasma180minN7000-1Polyimide0.75 1.5K1Plasma300minN7000-2Toughened Polyimide0.75 1.5K1 - 2Plasma240minN8000Cyanate Ester0.75 1.5K1Plasma300min第二部分Quotations报价Information Required to Quote要求客户提供信息Gerber File Data光绘文件Aperture File(except with 274*format)光圈文件Drill File钻孔文件Specifications(IPC standard

13、s,specifications,notes)标准（IPC标准、说明和注意事项等）Mechanical Drawing(dimensions)机械加工图纸Electronic Data Transfer数据传输方式MODEME-mail,FTPScaned Film扫描底片Optimiz ation of panelization done at quoting stage报价阶段将板规格最优化Standard manufacturing panels ：14*24；18*24（preferred）；21*24标准拼板尺寸：14*24；18*24；21*24Usable space：0.600

14、” border for double sided；0.750”border for multiplayer可使用范围:双面板，0.6英寸；多层板：0.75英寸Clearance:0.150”between boards for pinned routing 净空：板与板间预留0.15英寸外形定位空间Yield: 75% excellent yield 利用率：小于60%不好；大于75%利用率非常佳We cost by manufacturing panel,not board! 我们的报价是根据生产拼板，而不是交货板Standard 0.5”*6”coupons added to all m

15、ultiplayer board标准的0.5*6英寸付联板增加到所有的多层板上Multiple orientations are permissible 多层次的定位是允许的Tab gold fingers require busing, can limit orientation 金手指可控制朝向Registration requirements can limit panel sizeSome special restrictions: customer data size(Mb)；immersion gold tank size；etc. 一些特殊限制：客户数据大小；沉金槽尺寸；其他Sm

16、all boards preferred in array format 小板需要通过排布格式优化Printed Circuit Board Cost Driver Hierarchy 对PCB成本影响的趋势Layer Count 层数Physical Size(Panelization) 尺寸大小Surface Finishes 表面涂覆类型Board Thickness 板厚Surface Density 表面路线密度Specifications 规范特殊要求Drilling钻孔Depanelization板边大小Greater Impact影响大lesser Impact影响小and o

17、f course, Quantity and Delivery!当然，数量和交货期也是非常重要的因素。第三部分 Front End Engineering工程设计i) PAR (Produceability Analysis Report) 可制作性评审报告Receives customers board design data in a “Gerber” electronic format(i.e. board dimensions, hole sizes and count, layer order, special requirements) 收到客户设计线路板光绘文件（包括板的参数、孔

18、径大小和数量、层命令、特殊要求）Identification and Registration of layers 鉴别和定义层Runs Design Rule Inspection to identify concems which may impact manufacturability of board. 应用DRC检查确定涉及到制作能力的参数Sample Manufacturing Restrictions 生产能力限制Minimum PTH Diameter 最小金属化孔孔径：0.010”Minimum CU-CU Spacing 最小铜与铜间距：0.005”Minimum Trac

19、e Width 最小线宽：0.005”Minimum Annular Ring 最小环宽：0.0075Minimum Solder Mask Dam 最小阻焊桥：0.004”Identify manufacturability enhancements to be made (i.e. teardropping, plane clipping) 通过加辅助性设计提高可制作性（如泪滴、板编辑等）Forward Gerber data to sub contractor for generation of netlist and electrical test fixture 对照光绘文件数据产生

20、网络和电测夹具ii) Product Engineering 工程制作Customer specification review 客户资料检查Determination of stack-up for lamination 确定层压结构Determination of the Manufacturing Process(Job Planning) 确定制作流程Release Job to the floor with corresponding Flow Sheet通过流程单释放指示Controlled impedance calculations 阻抗控制计算iii) CAM（Compute

21、r Aided Manufacturing） CAM计算机辅助制造“Perfect” digital artwork panelization and alignment优化底片尺寸和定位1-UP edits, in-house customer correction and improvements with respect to manufacturing tolerances.(i.e.teardropping)根据客户要求修正文件，通过添加辅助设计降低生产制造难（如泪滴）Addition of date code, UL vendor code. 增加制造日期，公司UL标记等Uses

22、Gerber files generated at PAR应用光绘文件完成可制作性分析评审报告Step and Repeat for panelization(per quotation)分步和再现拼板Addition of test coupons to panels 添加测试付联条Creates the following programs 制作以下流程：Artwork plotting 光绘程序Drilling program 钻孔程序AOI(Automatic Optical Inspection) AOI文件Routing program 外形程序Scoring programiv)

23、 Photoplotting 激光光绘The artwork or phototool is plotted from the panelized Gerber data created in CAM 光绘机从处理好的光绘文件绘制底片Laser Photoplotter-0.00025”resolution 激光光绘机光绘极限0.00025英寸Silver halide emulsion (silver shot) 银盐片制作Diazo copies for some processes 重氮复片Positive and negative artworks depending on usage

24、 根据不同的胜任决定底片的正负性Artwork is punched with tooling holes with camera-target system 通过摄像标靶系统定位冲出底片上的工具孔Visual inspection for detects 目测检验开路Clean Room conditions(class 10,000)with controlled Temperature(20)and Relative Humidity(50%) 菲林洁净房的洁净度（10000级），温度（20）和相对湿度（50%）Artwork must be generated and used in

25、same environment 工作底片在制作和使用应在同亲环境Vertical film storage 重直保存底片Surface area calculations for plating 电镀面积计算第四部分Manufacturing Process 生产流程Printed Circuit Board Process Flowchart 流程图 i) inneriayer 内层1. Chemical Cleaning: Removes the anti-tarnish coating, dirt, grease, from the copper ciad laminate.化学清洗：

26、去除铜箔面上的氧化层、不光泽物、污物和油脂。2. Dry Film Lamination: Application of an UV sensitive film to the cleaned surface of the copper laminate through controlled heat and pressure. The line includes material surface preparation, CSL, loader and Stacker.在清洁的覆铜板两面贴上一层UV光敏材料干膜、贴膜通常在全自动贴膜机上完成，在加热加压的条件下将干膜粘贴在覆铜板面上。干膜中的

27、抗蚀剂层受热后变软，流动性增加，借助于热压辊的压力和抗蚀剂粘结剂的作用完成贴膜。3. Dry Film Exposure: A negative phototool or artwork is imaged into the dry film, on both sides of the copper clad, through UV light exposure leaving a positive image in the dry film.During exposure the UV energy is absorbed by the dry film directly underneat

28、h the clear areas of the overlaying artwork, causing it to polymerize and harden. The film covered by dark areas of the artwork remains soft.曝光：将负片底片覆盖在覆铜板两面，经过紫外光照射曝光后在干膜上产生正片图像。曝光过程是在紫外光照射下，未被底片挡住部分的干膜中的光引发剂吸收光能分解成洲离基，游离基再引发聚合单体进行交联反应，反应后生成不溶于稀碱溶液的体形大分子结构人。4. Dry Film Developing: After the dry fil

29、m is imaged, the unexposed soft areas of the film are dissolved away while the hardened dry film remains unaffected.显影：干膜中未曝光部分的活性基因与稀碱溶液反应生成可溶性物质而溶解下来，曝光部分的干膜不被溶解。5. Copper Etch: The remaining hardened dry film on the copper acts as a “Resist” and the unprotected copper is chemically dissolved or etched.蚀刻：保护性的干膜再覆铜板上形成图像，那些显影掉，未被干膜保护的不需要的铜