XXXX刚性PCB性能规范及验收标准.docx

XXXX刚性PCB性能规范及验收标准.docx

《XXXX刚性PCB性能规范及验收标准.docx》由会员分享，可在线阅读，更多相关《XXXX刚性PCB性能规范及验收标准.docx（82页珍藏版）》请在冰点文库上搜索。

XXXX刚性PCB性能规范及验收标准

DKBA

XXXX技术有限公司企业技术标准

XXXXX-2007.09

代替Q/DKBA3178.1-2006

刚性PCB性能规范及验收标准

2007年10月15日发布2007年11月01日实施

XXX技术有限公司

XXXTechnologiesCo.,Ltd.

版权所有XX

Allrightsreserved

前言..................................................................11

1范围...................................................................13

1.1范围.............................................................13

1.2简介.............................................................13

1.3关键词...........................................................13

2规范性引用文件.........................................................13

3术语和定义.............................................................13

4文件优先顺序...........................................................14

5材料品质...............................................................14

5.1板材..............................................................14

5.2介质厚度公差......................................................14

5.3PTH孔性能指标.....................................................15

5.4阻焊膜............................................................15

5.5标记油墨..........................................................15

5.6最终表面处理......................................................15

5.6.1热风整平.....................................................15

5.6.2化学镍金.....................................................15

5.6.3有机涂覆（OSP）..............................................16

5.6.4化学银.......................................................16

5.6.5化学锡.......................................................16

5.6.6电镀金手指...................................................17

2007-10-26华为文档，未经许可不得扩散第2页,共2页Page2,Total2

6外观特性...............................................................17

6.1板边..............................................................17

6.1.1毛刺/毛头..................................................17

6.1.2缺口/晕圈..................................................17

6.1.3板角/板边损伤..............................................18

6.2板面..............................................................18

6.2.1板面污渍...................................................18

6.2.2水渍.......................................................18

6.2.3异物（非导体）.............................................18

6.2.4锡渣残留...................................................18

6.2.5板面余铜...................................................18

6.2.6划伤/擦花..................................................19

6.2.7压痕.......................................................19

6.2.8凹坑.......................................................19

6.2.9GROUND面凹坑、铜粒.........................................19

6.2.10露织物/显布纹..............................................20

6.3次板面............................................................20

6.3.1白斑/微裂纹................................................20

6.3.2分层/起泡..................................................21

6.3.3外来杂物...................................................21

6.3.4内层棕化或黑化层擦伤.......................................22

6.4导线..............................................................22

2007-10-26华为文档，未经许可不得扩散第3页,共3页Page3,Total3

6.4.1缺口/空洞/针孔.............................................22

6.4.2镀层缺损...................................................22

6.4.3开路/短路..................................................22

6.4.4导线压痕...................................................22

6.4.5导线露铜...................................................22

6.4.6铜箔浮离...................................................23

6.4.7补线.......................................................23

6.4.8导线粗糙...................................................23

6.4.9导线宽度...................................................24

6.4.10阻抗.......................................................24

6.5金手指............................................................24

6.5.1金手指光泽.................................................24

6.5.2阻焊膜上金手指.............................................24

6.5.3金手指铜箔浮离.............................................24

6.5.4金手指表面.................................................25

6.5.5板边接点毛刺...............................................25

6.5.6金手指镀层附着力...........................................26

6.6孔................................................................26

6.6.1孔的公差...................................................26

6.6.2铅锡堵孔...................................................26

6.6.3异物堵孔...................................................27

6.6.4PTH孔壁不良................................................27

2007-10-26华为文档，未经许可不得扩散第4页,共4页Page4,Total4

6.6.5爆孔.......................................................27

6.6.6PTH孔壁破洞................................................27

6.6.7孔壁镀瘤...................................................28

6.6.8晕圈.......................................................28

6.6.9粉红圈.....................................................29

6.6.10表层PTH孔环................................................29

6.6.11表层NPTH孔环...............................................29

6.7焊盘..............................................................30

6.7.1焊盘露铜...................................................30

6.7.2焊盘拒锡...................................................30

6.7.3焊盘缩锡...................................................30

6.7.4焊盘损伤...................................................31

6.7.5焊盘脱落、浮离.............................................31

6.7.6焊盘变形...................................................31

6.7.7焊盘尺寸公差...............................................31

6.7.8导体图形定位精度...........................................32

6.8标记及基准点......................................................32

6.8.1基准点不良.................................................32

6.8.2基准点禁布区...............................................32

6.8.3基准点尺寸公差.............................................32

6.8.4字符模糊...................................................32

6.8.5标记错位...................................................33

2007-10-26华为文档，未经许可不得扩散第5页,共5页Page5,Total5

6.8.6标记油墨上焊盘.............................................33

6.8.7其它形式的标记.............................................33

6.9阻焊膜............................................................33

6.9.1导体表面覆盖性.............................................33

6.9.2阻焊膜厚度.................................................33

6.9.3阻焊膜脱落.................................................34

6.9.4阻焊膜起泡/分层............................................34

6.9.5阻焊塞孔...................................................35

6.9.6阻焊膜波浪/起皱/纹路.......................................36

6.9.7吸管式阻焊膜浮空...........................................36

6.9.8阻焊膜的套准...............................................37

6.9.9阻焊桥.....................................................38

6.9.10阻焊膜物化性能.............................................38

6.9.11阻焊膜修补.................................................38

6.9.12双层阻焊膜.................................................39

6.9.13板边漏印阻焊膜.............................................39

6.9.14颜色不均...................................................39

6.10外形尺寸.........................................................39

6.10.1板厚公差...................................................39

6.10.2外形尺寸公差...............................................39

6.10.3翘曲度.....................................................39

6.10.4拼板.......................................................40

2007-10-26华为文档，未经许可不得扩散第6页,共6页Page6,Total6

7可观察到的内在特性.....................................................40

7.1介质材料.........................................................41

7.1.1压合空洞...................................................41

7.1.2非金属化孔与电源/地层的空距................................41

7.1.3分层/起泡..................................................41

7.1.4过蚀/欠蚀..................................................42

7.1.5介质层厚度.................................................43

7.1.6树脂内缩...................................................43

7.2内层导体.........................................................43

7.2.1孔壁与内层铜箔破裂.........................................43

7.2.2镀层破裂...................................................44

7.2.3表层导体厚度...............................................44

7.2.4内层铜箔厚度...............................................45

7.2.5地/电源层的缺口/针孔.......................................45

7.3金属化孔.........................................................45

7.3.1内层孔环...................................................45

7.3.2PTH孔偏....................................................45

7.3.3孔壁镀层破裂...............................................46

7.3.4孔角镀层破裂...............................................46

7.3.5渗铜.......................................................46

7.3.6隔离环渗铜.................................................47

7.3.7层间分离（垂直切片）........................................47

2007-10-26华为文档，未经许可不得扩散第7页,共7页Page7,Total7

7.3.8层间分离（水平切片）.......................................48

7.3.9孔壁镀层空洞...............................................49

7.3.10孔壁腐蚀...................................................49

7.3.11盲孔树脂填孔...............................................50

7.3.12钉头.......................................................50

8特殊板的其它特别要求...................................................50

8.1背钻孔的特殊要求.................................................50

8.2阶梯孔、阶梯板的特殊要求.........................................51

8.2.1阶梯孔的要求.......................................