电路板术语总整理.docx

电路板术语总整理.docx

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电路板术语总整理

*****A*****

AbieticAcid松脂酸.

AbrasionResistance耐磨性.

Abrasives磨料,刷材.

ABS树脂.

Absorption吸收（入）.

AcImpedance交流阻抗.

AcceleratedTest（Aging）加速老化（试验）.

Acceleration速化反应.

Accelerator加速剂,速化剂.

Acceptability,Acceptance允收性,允收.

AccessHole露出孔,穿露孔.

Accuracy准确度.

AcidNumber（AcidValue）酸值.

AcousticMicroscope（AM）感音成像显微镜.

Acrylic压克力（聚丙烯酸树脂）.

ActinicLight（orIntensity,orRadiation）有效光.

Activation活化.

Activator活化剂.

ActiveCarbon活性炭.

ActiveParts（Devices）主动零件.

Acutance解像锐利度.

AdditionAgent添加剂.

AdditiveProcess加成法.

Adhesion附着力.

AdhesionPromotor附着力促进剂.

Adhesive胶类或接着剂.

Admittance导纳（阻抗的倒数）.

Aerosol喷雾剂,气熔胶,气悬体.

Aging老化.

AirInclusion气泡夹杂.

AirKnife风刀.

Algorithm算法.

AliphaticSolvent脂肪族溶剂.

AluminiumNitride（AlN）氮化铝.

AmbientTamp环境温度.

Amorphous无定形,非晶形.

Amp-Hour安培小时.

AnalogCircuit/AnalogSignal模拟电路/模拟讯号.

AnchoringSpurs着力爪.

AngleofContack接触角.

AngleofAttack攻角.

Anion阴离子.

Anisotropic异向性,单向的.

Anneal韧化（退火）.

AnnularRing孔环.

Anode阳极.

AnodeSludge阳极泥.

Anodizing阳极化.

ANSI美国标准协会.

Anti-FoamingAgent消泡剂.

Anti-pitAgent抗凹剂.

AOI自动光学检验.

Apertures开口,钢版开口.

AQL品质允收水准.

AQL（AcceptableQualityLevel）允收品质水准.

AramidFiber聚醯胺纤维.

ArcResistance耐电弧性.

Array排列.

Artwork底片.

ASIC特定用途绩体电路器.

AspectRatio纵横比.

Assembly组装装配.

A-stageA阶段.

ATE自动电测设备.

Attenuation讯号衰减.

Autoclave压力锅.

Axial-lead轴心引脚.

Azeotrope共沸混合液.

*****B*****

BackLight（BackLighting）背光法.

BackTaper反锥斜角.

Backpanels,Backplanes支撑板.

Back-up垫板.

BalancedTransmissionLines平衡式传输线.

BallGridArray球脚数组（封装）.

Bandability弯曲性.

BankingAgent护岸剂.

BareChipAssembly裸体芯片组装.

Barrel孔壁,滚镀.

BaseMaterial基材.

BasicGrid基本方格.

Batch批.

Baume波美度（凡液体比重比水重则Be=145-（145÷Sp.Gr）

凡液体比重比水轻则Be=140÷（Sp.Gr-130）

*Sp.Gr为比重即同体绩物质对"纯水"1g/cm的比值）.

Beamlead光芒式的平行密集引脚.

Bed-of-NailTesting针床测试.

BellowsConact弹片式接触.

BetaRayBackscatter贝他射线反弹散射.

Bevelling切斜边.

Bias斜张纲布,斜纤法.

Bi-LevelStencil]双阶式钢板.

Binder粘结剂.

Bits头（DrillBits）.

BlackOxide黑氧化层.

Blanking冲空断开.

Bleack漂洗.

Bleeding溢流.

BlindViaHole肓通孔.

Blister局部性分层或起泡.

BlockDiagram电路系统块图.

Blockout封纲.

Blotting干印.

BlottingPaper吸水纸.

BlowHole吹孔.

BluePlaque蓝纹（锡面钝化层）.

BlurEdge（Circle）模糊边带（圈）.

BombSight弹标.

BondStrength结合强度.

Bondability结合性.

BondingLayer结合层接着层.

BondingSheet（Layer）接合片.

BondingWire结合线.

Bow,Bowing板弯.

Braid编线.

Brazing硬焊（用含银的铜锌合金焊条）.

在425℃~870℃下进行熔接的方式）.

BreakPoint显像点.

Break-awayPanel可断开板.

BreakdownVoltage崩溃电压.

Break-out破出.

Bridging搭桥.

BrightDip光泽浸渍处理.

Brightener光泽剂.

BrownOxide棕氧化.

BrushPlating刷镀.

B-stageB阶段.

BuildUpProcess增层法制程.

Build-up堆积.

Bulge鼓起.

Bump突块.

BumpingProcess凸块制程.

Buoyancy浮力.

BuriedViaHole埋导孔.

Burn-in高温加速老化试验.

Burning烧焦.

Burr毛头.

BusBar汇电杆.

ButterCoat外表树脂层.

*****C*****

C4ChipJointC4芯片焊接.

Cable电缆.

CAD计算机辅助设计.

CalenderedFabric轧平式纲布.

CapLamination帽式压合法.

Capacitance电容.

CapacitiveCoupling电容耦合.

CapillaryAction毛细作用.

Carbide碳化物.

CarbonArcLamp碳弧灯.

CarbonTreatment,Active活化炭处理.

Card卡板.

CardCages/CardRacks电路板构装箱.

CarlsonPin卡氏定位稍.

Carrier载体.

Cartridge滤心.

Castallation堡型绩体电路器.

CatalyzedBoard,CatalyzedSubstrate催化板材.

Catalyzing催化.

Cathode阴极.

Cation阴向离子,阳离子.

CaulPlate隔板.

Cavitation空泡化半真空.

Center-to-CenterSpacing中心间距.

Ceramics陶瓷.

Cermet陶金粉.

Certificate证明书.

CFC氟氢碳化物.

Chamfer倒角.

CharacteristicImpedance特性阻抗.

Chase纲框.

CheckList检查清单.

Chelate螯合.

ChemicalMilling化学研磨.

ChemicalResistance抗化性.

Chemisorption化学吸附.

Chip芯片（粒）.

ChipInterconnection芯片互连.

ChiponBoard芯片粘着板.

ChipOnGlass晶玻接装（COG）.

Chisel钻针的尖部.

ChlorinatedSolvent含氯溶剂,氯化溶剂.

CircumferentialSeparation环状断孔.

Clad/Cladding披覆.

CleanRoom无尘室.

Cleanliness清洁度.

Clearance余地,余环.

ClinchedLeadTerminal紧箝式引脚.

Clinched-wireThroughConnection通孔弯线连接法.

ClipTerminal绕线端接.

Coat,Coating皮膜表层.

CoaxialCable同轴缆线.

CoefficientofThermalExpansion热膨胀系数.

Co-Firing共绕.

ColdFlow冷流.

ColdSolderJoint冷焊点.

CollimatedLight平行光.

Colloid胶体.

ColumnarStructure柱状组织.

CombPattern梳型电路.

ComplexIon错离子.

ComponentHole零件孔.

ComponentOrientation零件方向.

ComponentSide组件面.

Composites,（CEM-1,CEM-3）复合板材.

CondensationSoldering凝热焊接,液化放热焊接.

Conditioning整孔.

Conductance导电.

ConductiveSalt导电盐.

Conductivity导电度.

ConductorSpacing导体间距.

ConformalCoating贴护层.

Conformity吻合性,服贴性.

Connector连接器.

ContactAngle接触角.

ContactArea接触区.

ContactResistance接触电阻.

Continuity连通性.

ContractService协力厂,分包厂.

ControlledDepthDrilling定深钻孔.

ConversionCoating转化皮膜.

Coplanarity共面性.

Copolymer共聚物.

CopperFoil铜皮.

CopperMirrorTest铜镜试验.

CopperPaste铜膏.

Copper-Invar-Copper（CIC）综合夹心板.

CoreMaterial内层板材,核材.

CornerCrack通孔断角.

CornerMark板角标记.

Counterboring方型扩孔.

Countersinking锥型扩孔.

CouplingAgent偶合剂.

Coupon,TestCoupon板边试样.

Coverlay/Covercoat表护层.

Crack裂痕.

Crazing白斑.

Crease皱折.

Creep潜变.

CrossectionArea截面积.

CrosshatchTesting十字割痕试验.

Crosshatching十字交叉区.

Crosslinking,Crosslinkage交联,架桥.

Crossover越交,搭交.

Crosstalk噪声,串讯.

CrystallineMeltingPoint晶体熔点.

C-StageC阶段.

Cure硬化,熟化.

CurrentDensity电流密度.

Current-CarryingCapability载流能力.

CurtainCoating濂涂法.

*****D*****

DaisyChainedDesign菊瓣设计.

DatumReference基准参考.

DaughterBoard子板.

Debris碎屑,残材.

Deburring去毛头.

DeclinationAngle斜射角.

Definition边缘逼真度.

Degradation劣化.

Degrasing脱脂.

DeionizedWater去离子水.

Delamination分离.

DendriticGrowth枝状生长.

Denier丹尼尔（是编织纺织所用各种纱类直径单位,

定义9000米纱束所具有的重量（以克米计））.

Densitomer透光度计.

Dent凹陷.

Deposition皮膜处理.

Desiccator干燥器.

Desmearing去胶渣.

Desoldering解焊.

Developer显像液,显像机.

Developing显像.

Deviation偏差.

Device电子组件.

Dewetting缩锡.

D-glassD玻璃.

DiazeFilm偶氮棕片.

Dichromate重铬酸盐.

Dicing芯片分割.

Dicyandiamide（Dicy）双氰胺.

Die冲模.

DieAttach晶粒安装.

DieBonding晶粒接着.

DieStamping冲压.

Dielectric介质.

DielectricBreakdownVoltage介质崩溃电压.

DielectricConstant介质常数.

DielectricStrength介质强度.

DifferentialScanningCalorimetry（DSC）微差扫瞄热卡分析法.

DiffusionLayer扩散层.

Digitizing数字化.

DihedralAngle双反斜角.

DimensionalStability尺度安定性.

Diode二极管.

DipCoating浸涂法.

DipSoldering浸焊法.

DIP（DualInlinePackage）双排脚封装体.

Dipole偶极,双极.

Direct/IndirectStencil直接/间接版膜.

DirectEmulsion直接乳胶.

DirectPlating直接电镀.

DiscreteCompenent散装零件.

DiscreteWiringBoard散线电路板,复线板.

DishDown碟型下陷.

Dispersant分散剂.

DissipationFactor散失因素.

DisspationFactor散逸因子.

DisturbedJoint受扰焊点.

DoctorBlade修平刀,刮平刀.

DogEar狗耳.

Doping掺杂.

DoubleLayer双电层.

DoubleTreatedFoil双面处理铜箔.

DragIn/DragOut带[进/带出.

DragSoldering拖焊.

Drawbridging吊桥效应.

Drift漂移.

DrillFacet钻尖切削面.

DrillPointer钻针重磨机.

DrilledBlank已钻孔的裸板.

Dross浮渣.

DrumSide铜箔光面.

DryFilm干膜.

DualWaveSoldering双波焊接.

Ductility展性.

DummyLand假焊垫.

Dummy,Dummying假镀（片）.

Durometer橡胶硬度计.

DYCOstrate电浆蚀孔增层法.

DynamicFlex（FPC）动态软板.

*****E*****

E-Beam（ElectronBeam）电子束.

EddyCurrent涡电流.

EdgeSpacing板边空地.

Edge-BoardConnector板边（金手指）承接器.

Edge-BoardContact板边金手指.

Edge-DipSolderabilityTest板边焊锡性测试.

EDTA乙二胺四乙酸.

Effluent排放物.

E-glass电子级玻璃.

Elastomer弹性体.

ElectricStrength（耐）电性强度.

Electrodeposition电镀.

Electro-depositionPhotoresist电着光阻,电泳光阻.

Electroforming电铸.

Electroless-Deposition无电镀.

ElectrolyticToughPitch电解铜..

Electrolytic-Cleaning电解清洗.

Electro-migration电迁移.

Electro-phoresis电泳动,电渗.

Electro-tinning镀锡.

Electro-Winning电解冶炼.

Elongation延伸性,延伸率.

Embossing凸出性压花.

EMF（ElectromotiveForce）电动势.

EMI（ElectromagneticInterference）电磁干扰.

Emulsion乳化.

EmulsionSide药膜面.

Encapsulating胶囊.

Encroachment沾污,侵犯.

EndTap封头.

Entek有机护铜处理.

Entrapment夹杂物.

EntryMaterial盖板.

EpoxyResin环氧树脂.

EtchFactor蚀刻因子.

Etchant蚀刻剂（液）.

Etchback回蚀.

EtchingIndicator蚀刻指针.

EtchingResist蚀刻阻剂.

EuteticComposition共融组成.

Exotherm放热（曲线）.

Exposure曝光.

Eyelet铆眼.

*****F*****

Fabric纲布.

FaceBonding反面朝下结合.

Failure故障.

FanOutWiring/FanInWiring扇出布线/扇入布线.

Farad法拉.

Farady法拉第.

FatigueStrength抗疲劳强度.

Fault缺陷.

FaultPlane断层面.

FeedThroughHole导通孔.

Feeder进料器.

FiberExposure玻纤显露.

FiducialMark基准记号.

Filament纤丝.

Fill纬向.

Filler填充料.

Fillet内圆填角.

Film底片.

FilmAdhesive接着膜,粘合膜.

Filter过滤器.

FineLine细线.

FinePitch密脚距,密线距,密垫距.

Fineness粒度,纯度.

Finger手指.

Finishing终修（饰）.

FiniteElementMethod有限要素分析法.

FirstArticle首产品.

FirstPass-Yield初检良品率.

Fixture夹具.

Flair刃角变形.

FlamePoint自燃点.

FlameResistant耐燃性.

FlammabilityRate燃性等级.

Flare扇形崩口.

FlashPlating闪镀.

Flashover闪络.

FlatCable扁平排线.

FlatPack扁平封装（之零件）.

Flatness平坦度.

FlexiblePrintedCircuit（FPC）软板.

FlexuralFailure挠曲损坏.

FlexuralModule弯曲模数,抗挠性模数.

FlexuralStrength抗挠强度.

FlipChip覆晶,扣晶.

Flocculation絮凝.

FloodStrokePrint覆墨冲程印刷.

FlowSoldering（WaveSoldering）流焊.

Fluorescence荧光.

FlurocarbonResin碳氟树脂.

FlushConductor嵌入式线路,贴平式导体.

FlushPoint闪火点.

Flute退屑槽.

Flux助焊剂.

FoilBurr铜箔毛边.

FoilLamination铜箔压板法.

Foot残足（干膜残余物）.

FootPrint（LandPattern）脚垫.

ForeignMaterial外来物,异物.

Form-to-List布线说明清单.

FourPointTwisting四点扭曲法.

FreeRadical自由基.

Freeboard干舷.

Frequency频率.

Frit玻璃熔料.

Fully-AdditiveProcess全加成法.

FungusResistance抗霉性.

FusedCoating熔锡层.

Fusing熔合.

FusingFluid助熔液.

*****G*****

G-10由连续玻纤所织成的玻纤布与

环氧树脂粘结剂所复合成的材料.

Gage,Gauge量规.

GalliumArsenide（GaAs）砷化镓.

GalvanicCorrosion贾凡尼式腐蚀（电解式腐蚀）.

GalvanicSeries贾凡尼次序（电动次序）.

Galvanizing镀锌.

GAP第一面分离,长刃断开.

GateArray闸列,闸极数组.

GelTime胶化时间.

GelationParticle胶凝点.

GerberData,GerberFile格博档案（是美商Gerber公司专为PCB面线路

图形与孔位,所发展一系列完整的软件档案）.

GhostImage阴影.

Gilding镀金（现为:

GlodPlating）.

GlassFiber玻纤.

GlassFiberProtrusion/Gouging,Groove玻纤突出/挖破.

GlassTransitionTemperature,Tg玻璃态转化温度.

Glaze釉面,釉料.

GlobTop圆顶封装体.

GloubleTest球状测试法.

Glycol（EthyleneGlycol）乙二醇.

GoldenBoard测试用标准板.

GrainSize结晶粒度.

GrassLeak大漏.

Grid标准格.

GroundPlane/EarthPlane接地层.

GroundPlaneClearance接地空环.

GuidePin导针.

Gull/WingLead鸥翼引脚.

*****H*****

Halation环晕.

HalfAngle半角.

Halide卤化物.

Haloing白圈,白边.

Halon海龙,是CFC"氟碳化物"的一种商品名.

HardAnodizing硬阳极化.

HardChromePlating镀硬铬.

HardSoldering硬焊.

Hardener（CuringAgent）硬化剂（或CuringAgent）.

Hardness硬度.

Haring-BlumCell海固槽.

Harness电缆组合.

HayWire跳线.

HeatCleaning烧洁.

HeatDissipation散热.

HeatDistortionPoint（Temp）热变形点（温度）.

HeatSealing热封.

HeatSinkPlane散热层.

HeatTransferPaste导热膏.