毕业论文外文翻译-stm32简介Word格式文档下载.doc
《毕业论文外文翻译-stm32简介Word格式文档下载.doc》由会员分享,可在线阅读,更多相关《毕业论文外文翻译-stm32简介Word格式文档下载.doc(12页珍藏版)》请在冰点文库上搜索。
STMicroelectronicsGroupwasestablishedinJune1987,isamergerofItaly'
sSGSMicroelectronicsandtheFrenchThomsonsemiconductorcompany.InMay1998,SGS-THOMSONMicroelectronicswillchangethecompanynametoSTMicroelectronicsLimited.STMicroelectronicsisoneofthelargestsemiconductorcompaniesintheworld.Fromitsinceptiontodate,ST'
sgrowingfasterthantheoverallrateofgrowthofthesemiconductorindustry.Since1999,SThasalwaysbeenoneoftheworld'
stoptensemiconductorcompanies.Accordingtothelatestindustrystatistics,STMicroelectronicsistheworld'
sfifthlargestsemiconductormanufacturerandaworldleaderinmanymarkets.Forexample,STMicroelectronicsistheworld'
slargestdedicatedanalogchipsandpowerconversionchipmanufacturers,theworld'
slargestindustrialsemiconductorandset-topboxchipsuppliersanddiscretedevices,mobilephonecameramoduleandcarfieldofintegratedcircuitshighestintheworld.
STMicroelectronicshastheentiregroupemploysnearly50,000,with16state-of-the-artR&
Dinstitutionsand39designandapplicationcenters,15mainmanufacturingplant,andhas78salesofficesin36countries.ThecompanyisheadquarteredinGeneva,Switzerland,isalsotheheadquartersofEuropeanandemergingmarkets;
company'
sU.S.headquartersinDallas,Texas,Carrollton;
Asia-PacificheadquartersinSingapore;
businessinJapanbyTokyoasaheadquarters;
GreaterChinaheadquartersinShanghai,responsibleforbusinessinHongKong,mainlandChinaandTaiwan.
December8,1994forthefirsttimesincethecompletionofthepublicofferingofshares,STMicroelectronicshasbeeninNewYorkStockExchange(tickersymbol:
STM)andPanOuBaliStockExchangelisted,inJune1998,inMilan,Italy,securitiesExchange.STMicroelectronicshasnearly900millionsharesinthepublicofferingofshares,ofwhichapproximately71.1%ofthesharesarepubliclytradedonthevariousstockexchanges.Another27.5%ofthestockbySTMicroelectronicsHoldingIIBVLimitedhelditsshareholdersFinmeccanicaandCDPItalianFinmeccanicaconsortiumArevaandFranceTelecom,theFrenchconsortium;
remaining1.4%oftreasurysharesbySTMicroelectronicshold.
b.STultra-low-powerARM®
Cortex™-M3microcontroller
STM32Lseriesofproductsarebasedontheultra-low-powerARMCortex-M3processorcore,STMicroelectronicstwouniqueenergy-savingtechnologies:
130nmdedicatedlow-leakagecurrentmanufacturingprocessandoptimizeenergy-savingarchitecturetodeliverindustry-leadingenergy-savingperformance.Thisseriesbelongstothelineup32STMicroelectronicsSTM32microcontrollerproductfamily,theproductfamily,atotalof180balanceofproduct,thefullrangeofproductssharemostofthepin,softwareandperipherals,excellentcompatibilitywithdeveloperstothemaximumdesignflexibility.
c.STultra-low-powerARM®
Cortex™-M0microcontroller
STM32F0seriesofproductsarebasedontheultra-low-powerARMCortex-M0processorcoretechnologyandfeatures,enhancedintegration,aimedattheapplicationofultra-low-costbudget.Thefamilyofmicrocontrollerstoshortenthe8-bitand16-bitmicro-controllerdevicesandtheperformancegapbetweenthe32-bitmicrocontrollerdevice,theuserterminalproductsintheeconomytoachievestate-of-the-artcomplexfeatures.
d.Products
BeforeSTM32F105andSTM32F107interconnectfamilyofmicrocontrollers,STMicroelectronicshasintroducedtheSTM32AccessLineEnhancedSeries,theseriesoftheUSBbasicseriesandenhanced;
newproductsfollowtheEnhancedSeries72MHzprocessingfrequency.Memory64KBto256KBFlashand20KBto64KBembeddedSRAM.TheLQFP64,LQFP100,andLFBGA100threepackageinthenewseries,adifferentpackagetomaintainthepinoutconsistency,combinedwiththeSTM32platformdesignphilosophy,anddevelopersbyselectingtheproductscanbere-optimizationfunction,memory,performanceandpincount,withaminimumofhardwarechangestomeetindividualapplicationneeds.
UntilJuly1,2010,thecirculationofmodels:
Basic:
STM32F101R6STM32F101C8STM32F101R8STM32F101V8STM32F101RBSTM32F101VB
Enhanced:
STM32F103C8STM32F103R8STM32F103V8STM32F103RBSTM32F103VBSTM32F103VESTM32F103ZE
STM32modelsDescription:
STM32F103RBT6chipmodel,forexample,thecompositionsofthemodelsofsevenparts,itsnamingrulesareasfollows:
(1)STM32:
STM32ARMCortex-M3representskernelof32-bitmicrocontrollers.
(2)F:
Frepresentsthechipsub-series.
(3)103:
103representativesEnhancedSeries.
(4)R:
RThisisarepresentativeofthenumberofpins,whereTrepresents36feet,48feet,Crepresents,Rrepresentsa64feet,Vrepresentsthe100-pin144-pin,Zrepresents.
(5)B:
BarepresentativeofembeddedFlashcapacity,including6onbehalfof32KbytesofFlash,8onbehalfof64KbytesFlash,384KbytesFlashBonbehalfof128KbytesFlash,Conbehalfof256KbytesFlash,DrepresentativesEonbehalfof512KbytesFlash.
(6)T:
Tarepresentativeofthepackage,inwhichHrepresentsBGApackage,TrepresentsLQFPpackage,UrepresentsVFQFPNpackage.
(7)6:
6Thisisarepresentativeoftheoperatingtemperaturerange,where6represents-40-85℃,7onbehalfof-40-105℃.
e.STM32F103performancecharacteristics
Feature
1.Thekernel:
ARM32-bitCortex-M3CPU,themaximumoperatingfrequencyof72MHz,1.25DMIPS/MHz.Single-cyclemultiplyandhardwaredivision.
2.Memory:
integratedon-chip32-512KBofFlashmemoryand6-64KBSRAMmemory.
3.Clockresetandpowermanagement:
2.0-3.6VdrivevoltageofthepowersupplyandI/Ointerface,POR,PDRandprogrammablevoltagedetector(PVD),4-16MHzcrystaloscillator,embedded8MHzRCoscillatortuningcircuitinthefactory,40kHzinternalRCoscillatorcircuit.FortheCPUclockPLL.WiththecalibrationfortheRTC32kHzcrystal.
4.Lowpowerconsumption:
threekindsoflow-powermodes:
Sleep,stop,standbymode.PoweredtheVBATRTCandbackupregisters.
5.Debugmode:
serialdebug(SWD)andJTAGinterfaces.
6.DMA:
12-channelDMAcontroller;
supportedperipherals:
timers,ADC,DAC,SPI,IICandUSART.
7.212usclassA/Dconverter(16-channel):
A/Dmeasurementrange:
0-3.6V.Dualsampleandholdcapability.Thechipintegratesatemperaturesensor.
8.2-channel12-bitD/Aconverter:
STM32F103xCSTM32F103xDSTM32F103xEunique.
9.Amaximumofupto112fastI/Oports:
Dependingonthemodel,26,37,51,80,and112I/Oports,allportscanbemappedtothe16externalinterruptvector.Inadditiontotheanaloginputcanacceptlessthan5Vinput.
10.Amaximumofupto11timers:
four16-bittimers,eachtimer4IC/OC/PWMorpulsecounter.Two16-channeladvancedcontroltimer:
upto6channelsforPWMoutput.2watchdogtimers(independentwatchdogandwindowwatchdog).Systicktimer:
24-bitdowncounter.Two16-bitbasictimerisusedtodrivetheDAC.
11.Amaximumofupto13communicationinterfaces:
twoIICinterface(SMBus/PMBus),5USARTinterface(ISO7816interface,LIN,IrDAcompatible,thedebuggingcontrol),ThreeSPIinterface(18Mbit/s),twoandIISreuse,CANinterface(2.0B),USB2.0full-speedinterface,SDIOinterface.
12.ECOPACKpackage:
STM32F103xxfamilyofmicrocontrollersECOPACKpackage.
Systemrole
1.IntegratedembeddedFlashandSRAMmemory,ARMCortex-M3core.Andcomparedtothe8/16devices,theARMCortex-M332-bitRISCprocessorprovidesahigherefficiencyofthecode.TheSTM32F103xxmicrocontrollerwithanembeddedARMcore,socanbecompatiblewithallARMtoolsandsoftware.
2.EmbeddedFlashmemoryandRAMmemory:
built-upto512KBembeddedFlash,canbeusedtostoreprogramsanddata.Upto64KBofembeddedSRAMcanreadandwritetotheclockspeedoftheCPU(notwaitstate).
3.Avariablestaticmemory(FSMC):
FSMCembeddedinSTM32F103xC,STM32F103xD,STM32F103xE,withfourchipselectsupportfourmodes:
Flash,RAM,PSRAM,NORandNAND.AfterORafterthreeFSMCinterruptlinesconnectedtotheNVIC.Noread/writeFIFOPCCARDoutside,thecodeisexecutedfromtheexternalmemory,anddoesnotsupporttheBoottooktargetfrequencyequaltoSYSCLK/2Therefore,whenthesystemclockis72MHz,externalaccess,accordingto36MHz.
4.Nestedvectorinterruptcontroller(NVIC):
canhandle43maskableinterruptchannels(notincludingthe16interruptlinesofCortex-M3),provides16interruptpriority.TightlycoupledNVIClowerinterruptprocessingdelaydirectlypassedtothekernelinterruptentryvectortableaddress,tightlycoupledtheNVICkernelinterface,allowsinterruptstobeanticipated,afterthehigher-priorityinterrupthandlingsupporttailchain,automaticallysavethestateoftheprocessor,interruptentryautomaticallyresumewhentheinterruptexit,noinstructionintervention.
5.Theexternalinterrupt/eventcontroller(EXTI):