半导体工艺介绍PACKAGE.pptx

1、1,2,Puman,3,WaferManufacturing,FrontEnd,Wafer,Test,BackEnd,CM P,4,(QFP),Wafer back grinding,Wafer mount,Wafer saw&clean,Die attach,Epoxy cure,Plasma clean,Wire bond,Molding,Marking,Post mold cure,Deflash&Trim,Solder plating,Forming&singulation,FVI,Packing,5,:BT Epoxy PTFE Polyimide compound,UBM PSV

2、APPE Solder mask P.R,95 Pb/5 Sn37 Pb/63 Sn(,183)No Lead,Ally,Sn 3.9/Ag 0.6/Cu 5.5,235 Low-Ally,:Au bond Ally bond,Lead Frame:,Substrate:(tape),HiTCETM BCBTM!,TAPE:,Blue Tape UV Tape,Heat Sink:#,6,Polishing machine&CMPUV tape attach machineDicing machineUV irradiation machineTape remover machine,Pick

3、&Place machine,Package machine,(F/T):trim&form,80,7,!,8,IC,$%IC,&chip(system,)*+,-./0.12IC 345,88,99,:,;,=,667677,8,9,:,;,=,?,?ICAABBCC45 DEFGHIJKLMN,OOOO888,8999,9,EEEP=QRSTUVE WX,PP=QQRRSSTTUUVVEE,WWXXchip size BCYIC 3Z,UUU,chip_ abcdefUVEgchiphijefkkH,IC,DIP,lmnolpqrmstrusv nqxyqzv=|?A?N,djdj?U?U

4、?j?j?HT?l?mn NAd o?mn?hiAU?EU?h?i,?llm n n?N?d?HH?lm?nUUA?A?2?2?j?j?(?(?,?T?U2?hiH,D?IP?n?o?Nd?U?H,?0?A0?)*I?U?H,DIP,n?n?n?uxysv?K?K?ur,?vq?u?x?x?u?u?rurur,DIP,PDIP Plastic DIP CDIP Ceramic DIP,SPDIP Shrink plastic DIP,9,SOP/SOJ,10,1980?USMT Surface Mounting Technology BC4?U?,SMT?8?USOP Small Out-Li

5、ne Package/SOJ Small,Out-LineJ-Lead package?)?Uhi?IC?H,SOP/SOJ,!#$%&($#)*+,*+,-.,/012,*3/+,SOP(),n?n?uxysv?u?uururr,?vq?u?x?x?urSOJ(Small Out-LineJ-Lead package),n?n?uxysv?u?u?r?r?ur,?vq?u?x?x?u?u?r?ur,11,SOP!#SSOP(Shrink SOP),n?uuxxyyssvv?K?uurr,?vq?u?x?x?x?u?u?u?r?ur,2.TSOP(Thin SOP),n?n?uxysv?K?K

6、?,?vq?u?x?x?,12,3.TSSOP(Thin Shrink SOP),n?n?uxysv?K?K?,?vq?u?x?x?,4.TSOP():ThinSOP$,5.TSOP(%):ThinSOP%,QSOPQVSOP,:Quarter Size Outline Package:Quarter Size Very Small Outline Package,13,14,TU?ni?nrq?U?u?x?p?q?rq?nq?xy?qz?v NAd?h?i?)*A?U?,AhAhAhA?i?i?i?j?j?j?B?B?B?BC?C?C?C?D?H?HA?l?A?l?D0?,?UU?U?U?D

7、D?0?0?D D?H?H?i?i?H?H?UiUiJ J,?n?n n rq?=ux?rq?nq xy?qz v H?A?n?,?H?H?H?H?=?n?U n?n?2=?U?2=,1.?SMD?0?ABC?PCBNd?A cH,2.?gH,3.?U?H,4.?0?A0?)*I?T,!#!$%,!,!-&./(0)12*/3+45?uxysv?K?,?n?n?n?nv?v?v?v?q?q?q?q?u?u?u?u?u?u?u?u?x?x?x?x?y?y?y?y?s?s?s?sv?,?vq?u?x?,15,6-7.78 49,:-;.;=4,!,16,-;.;1=4,!,?-;.;2/1 4,!

8、,17,A-B;.BC1/=;2/1#4,#,!,D-B=7.BC1/=7 7 4,!,18,HEHE-FF6 6.1F1F 22GG2=88 4 4 4,-=B I;,19,6J6J-KLK.K 8 1/=/0 12/3 4,6-PLCC(Plastic Leaded Chip Carrier Package),20,21,PGA,!#!$%&()*,+,-B.BC/C0D0D1 1 2 2 3 3 4E5/F G6H I7J8K9L:;M?/?O PQA,RbRb_S S T T U U a a VH WI EXYC)DZcdFef _ H aI _?_ O PQ,g hi/,PGA&(,

9、)(MN,jk lmnL M7opq/,;k7rsLq tu,Intel!CPU*+80486,Pentium Pentium,Pro,-./01,PGA&(),22,BGA!#$%&()*!#&+,-.,23,/0012345$%6 789?,AAA100MHzB)CD E F;G8HIJ&“Cross,Talk”KL)MN=IC&OPQRS208 Pin,B)CD&,EEE,E TTTUUUVVV 4,44WWW)XXXYYYZZZQFP,E)KR,QQ,&PPQQ_ aa,_bb_cd efMYZ,BGA(Ball Grid Array Package)$%1,OPI!QRSTMN5,1

10、.I/OgPQhij)kgP l&mnoRSQFP,E)pq!9?1,2.hiBGA&:rj.)ksStZ&3Fuvw_,xyz)MF|;1,3.C?)?RRp1,4.c FZ?yz)F?RRp1,24,BGA 23:Substrate,BGA IC?3?,(Wire Bonding)?(Tape Automated)?,(Flip Chip)?#,Area Array?5IC!#$?%,&()BGA*b+,&?z-./?0,123 2?123 4 BGA BGA?5,6)2/3 BGA 78?BGA 9:*?;?,=,BGA2345/6789:;=:,1.CBGA(Ceramic BGA),

11、2.PBGA(Plastic BGA)3.TBGA(Tape BGA)4.MBGA(Metal BGA),BGA?2333555/666777888999:;=:,25,1.&P&BG?A?P1lastic?52-4?!,2.?CBlG&A?Ce?razm?ic?t?t Z Z?_?)_b?,FlipChip,?l&?z?tZ?_)?,?FC&?E 1,3.FCBGA,Rigid,?1,4.TBGA,Tape?5?&1-2,?PCB#,?,1,5.CDPBGA Cavity Do,wn Plastic,?E,?w&_,?1,1.PBGA(Pastic BGA),ball:0.550.75mm

12、ball count:1001000 ball pitch:1.01.7mm substrate Thk:0.56mm body Thk:1.561.73mm PKG Thk:2.162.33mm2.LBGA(Low-profile BGA)ball:0.300.60mm ball count:1001000 ball pitch:0.81.0mm substrate Thk:0.36mm body Thk:0.90mm PKG Thk:1.301.60mm,26,3.LTBGA(Low-profile Tape BGA),ball:0.45mmball count:1001000 ball

13、pitch:0.80mm substrate Thk:0.1mm body Thk:0.80mm PKG Thk:1.20mm4.TFBGA(Thin&Fine pitch BGA)ball:0.300.60mm ball count:1001000 ball pitch:0.501.0mm substrate Thk:0.36mm body Thk:0.89mm PKG Thk:1.201.60mm,27,5.TFTBGA(Thin&Fine-pitch Tape BGA),ball:0.40mmball count:1001000 ball pitch:0.75mm substrate T

14、hk:0.10mm body Thk:0.75mm PKG Thk:1.10mm6.EDHSBGA(Exposed Drop-in Heat Sink BGA)ball:0.75mmball count:1001000 ball pitch:1.27mm substrate Thk:0.56mm body Thk:1.73mm PKG Thk:2.33mm,28,6.STFBGA(Stacked Thin&Fine-pitch BGA),ball:0.801.0mm ball count:1001000 ball pitch:0.40mm substrate Thk:0.26mm body T

15、hk:0.96mm PKG Thk:1.40mm,7.CDTBGA(Cavity Down Tape BGA),ball:0.600.75mm ball count:1001000 ball pitch:1.01.27mmsubstrate Thk:1.01.2mm body Thk:1.01.2mm PKG Thk:1.60mm,29,8.L2BGA/EBGA,(Laser laminate BGA/Enhanced BGA)Laser laminate BGA/Enhanced BGA are cavity down,thermally enhanced BGA with laminate

16、d substrate.They are suitable for solutions for high powerdissipation applications(6w).L2BGA with laser drilled via enhances circuitry EBGA uses BTlaminated with multiple layers at a very competitive cost.Superior electrical performance is achieved by multiple metal layer laminate based construction

17、.ball:0.600.75mm ball count:1001000 ball pitch:1.01.27mmsubstrate Thk:1.01.2mm body Thk:1.01.2mm PKG Thk:1.60mm,30,9.MCMBGA(Multi-chip Module BGA),ball:0.600.75mm ball count:1001000 ball pitch:1.27mm substrate Thk:0.56mm body Thk:1.561.73mm PKG Thk:2.162.33mm10.FCBGA(Flip Chip BGA)ball:0.600.75mm ba

18、ll count:1002000 ball pitch:1.01.27mmsubstrate Thk:1.02.0mm body Thk:3.0mmPKG Thk:3.5mm,31,BGA,HPBGA(High Performance BGA),chip array BGA,Tape Array BGA,Tape super BGA,AB#CD:Micro BGA,Viper BGA,32,BGA,33,!U VWXY,34,MCM(Multi Chip Module),35,ON P QR9:S T9:UV Q:,WX YZ1 W_ a b cL d)efghi jkl ON mn opq

19、r*!bs tu a bvw xy 1,z|qr$c 4Fi!,j;k k x y v?w?x y z?|OY?/q/,?k?7op?q/?F ONP)eR?c?W?ON?Pjp?U?|?2G?*,MCM:,36,MCM:,37,SiP(System in Package),Semiconductorindustrydemandsforhigherlevels,ofintegration,lowercosts,andagrowingawarenessof,completesystemconfigurationhavecontinuedtodrive,System in Package(SiP)

20、solutions.,SiP,:,38,CSP(Chip Scale Package)Z!,39,!#$%$(!)*+),(-./0 1 2 3 4 5 6 7 8,9D9D=:E:E347 7 8F8FG;HIO;PQ=$(.R?=D ST FGAU I7.8BC,CSFPGV!W2Q3R4ASXYTZMDN5 _.,HeHeG3f3f4=4=JgJgKhKhiijjkkJlJlKbKba.a.b Mcd1.,CSP E:;,FFGGLead Frame Type(),2.Rigid Interposer Type(),3.Flexible Interposer Type(),4.Wafer

21、 Level Package(),CSP:Flip Chip,40,Flip Chip(?):?T?U1960?IBM?C4(Controlled Collapse Chip Connection)?7I/O pad?_?,?P?,?Z?c(wirebonding)?Uj2G?N:?P?W?W?;?(metal bump)?(tape-automated bonding)?t*?e)?Up?U)?d?e?e?U?I/O?IC?N:(flip chip on board FCOB)|?UI/O?IC?m:(flip chip in package FCIP)t*FCOBe?(direct chi

22、p attachment DCA)?,CSP:bumping,41,CSP FGB HIJK,Area array bumping&Peripheral bumping,1 Peripheral bumping?bump,a?I),33?_,?_pad,?bump)!?1W?,bump,x?K1,2 Area array bumping?bump,a I)3?,AAA?,?_,?_ pad,?)!?)W,?bumpx+,?*?1,42,CSP FGBHIJK RedistributionProcessResult,43,ETCSPExtremely Thin CSP,44,FCCSP Chip

23、 Scale CSP,ball:0.30mmball count:100200 ball pitch:0.75mm,substrate Thk:0.5mm,body Thk:1.0mm,PKG Thk:1.2mm,Quad Flat No-lead,QFN,Lead width:0.180.30mm Leadl count:10200lead pitch:0.40.8mm body Thk:0.65mm PKG Thk:0.85mm,45,WLCSP(Wafer Level CSP),WLCSP():,.,:,WAFER,WAFER Backgrind,WAFER monut/Saw,Visu

24、al Inspect,Pick&Place to tray,Pack&Ship Die,WAFER Bumping,WAFER Probe,Laser Mark,SiP/Lead frame/laminate pack,ship,WAFER monut/Saw,46,47,:,48,1 121L/100%MMMNNNOOOPPPQQQRRRSSS,168TTT UUUVVVWWWXXXYYYZ,PCT,2,150LPQRS,1000T U_YZHTSL,3 85L/85%,MNOPQRS,1000T CPOPa,YYZ,ZRHTHBT,4,1000b,-55Lc,+125LPdeYZ,5 130L/85%,MNOPQRS168T CfgPhiY,Z,49,!#$%Y Z C OP,Z _abc60-70%dBGAef$%,cgh ij kl VmnNCDmo p,qrst9uBGA.vw+OPQ1j,50,