电路板中英文专业术语词汇NZWord下载.docx

1、Outgassing出气,吹气.Outgrowth悬出,横出,侧出.Output产出,输出.Overflow溢流.Overhang总悬空.Overlap 钻尖点分离.Overpotantial（Over voltage）过电位,过电压.Oxidation氧化.Oxygen Inhibitor氧化抑制剂.Ozone Depletion臭氧层耗损.*P*Packaging封装,构装.Pad焊垫,圆垫.Pad Master圆垫底片.Pads Only Board唯垫板.Palladium钯.Panel制程板.Panel Plating全板镀铜.Panel Process全板电镀法.Paper Phe

2、nolic纸质酚醛树脂（板材）.Parting Agent脱膜剂.Passivation钝化 ,钝化外理.Passive Device （Component）被动组件（零件）Paste膏,糊.Pattern板面图形.Pattern Plating线路电镀.Pattern Process线路电镀法.Peak Voltage峰值电压.Peel Strength抗撕强度.Periodic Reverse （PR） Current周期性反电流.Peripheral周边附属设备.Permeability透气性,导磁率.Permittivity诱电率,透电率.pH Value酸碱值.Phase相.Phas

3、e Diagram相图.Phenolic酚醛树脂.Photofugitive感光褪色.Photographic film感光成像之底片.Photoinitiator感光启始剂.Photomask光罩.Photoplotter, Plotter光学绘图机.Photoresist光阻.Photoresist Chemical Machinning （Milling）光阻式化学（铣刻）加工.Phototool底片.Pick and Place拾取与放置.Piezoelectric压电性.Pin 插脚,插梢,插针.Pin Grid Array （PGA）矩阵式针脚对装.Pinhole针孔.Pink R

4、ing粉红圈.Pitch跨距,脚距,垫距,线距.Pits凹点.Plain Weave平织.Plasma电浆.Plasticizers可塑剂,增塑剂.Plated Through Hole镀通孔.Platen热盘.Plating镀.Plotting标绘.Plowing犁沟.Plug插脚,塞柱.Ply层,股.Pneumatic Stretcher气动拉伸器.Pogo Pin伸缩探针.Point 钻尖.Point Angle钻尖面.Point Source Light点状光源.Poise泊.粘滞度单位=1dyne*sec/cm2.Polar Solvent极性溶剂.Polarity电极性.Polar

5、ization分极,极化.Polarizing Slot偏槽.Polyester Films聚酯类薄片.Polymer Thick Film （PTF）厚膜糊.Polymerization聚合.Polymide（PI）聚亚醯胺.Popcorn Effect爆米花效应.Porcelain瓷材,瓷面.Porosity Test疏孔度试验.Positive Acting Resist正性光阻剂.Post Cure后续硬化,后烤.Post Separation后期分离,事后公离.Pot Life运用期,锅中寿命.Potting铸封,模封.Power Supply电源供应器.Preform 预制品.Pr

6、eheat预热.Prepreg胶片,树脂片.Press Plate钢板.Press-Fit Contact挤入式接触.Pressure Foot 压力脚.Pre-tinning预先沾锡.Primary Image线路成像.Print Through压透,过度挤压.Probe探针.Process Camera制程用照像机.Process Window操作范围.Production Master生产底片.Profile轮廓,部面图,升温曲线图棱线.Propagation传播.Propagation Delay传播延迟.Puddle Effect水坑效应.Pull Away拉离.Pulse Plat

7、ing脉冲电镀法.Pumice Powder 浮石粉.Punch冲切.Purge, Purging净空,净洗.Purple Plague紫疫（金与铝的共化物层）.Pyrolysis热裂解,高温分解.*Q*Quad Flat Pack （QFP）方扁形封装体.Qualification Agency资格认证机构.Qualification Inspection资格检验.Qualified Products List合格产品（供应者）名单.Qualitative Analysis定性分析.Quality Conformance Test Circuitry （Coupon）品质符合之试验线路（样板

8、）.Quantitative Analysis定量分析.Quench 淬火,骤冷.Quick Disconnect快速接头.Quill纬纱绕轴.*R*Rack 挂架.Radial Lead放射状引脚.Radio Frequency Interference （RFI）射频干扰.Rake Angle抠角,耙角.Rated Temperature, Voltage额定温度,额定电压.Reactance电抗.Real Estate底材面,基板面.Real Time System 实时系统.Reclaiming再生,再制.Rediometer辐射计,光度计.Reel to Reel卷轮（盘）式操作.R

9、eference Dimension参考尺度.Reference Edge参考边缘.Reflection反射.Reflow Soldering重熔焊接,熔焊.Refraction折射.Refractive Index折射率.Register Mark对准用标记.Registration对准度.Reinforcement补强物.Rejection剔退,拒收.Relamination（Re-Lam）多层板压合.Relaxation松弛.缓和.Relay继电器.Release Agent, Release Sheets脱模剂,离模剂.Reliability可靠度,可信度.Relief Angle浮角

10、.Repair修理.Resin Coated Copper Foil背胶铜箔.Resin Content胶含量,树脂含量.Resin Flow胶流量,树脂流量.Resin Recession树脂下陷.Resin Rich Area 多胶区,树脂丰富区.Resin Smear胶（糊）渣.Resin Starve Area缺胶区,树脂缺乏区.Resist阻膜,阻剂.Resistivity电阻系数,电阻率.Resistor电阻器,电阻.Resistor Drift电阻漂移.Resistor Paste电阻印膏.Resolution解像,解像度,分辨率.Resolving Power解析（像）力,分辨

11、力.Reverse Current Cleaning反电流（电解）清洗.Reverse Etchback反回蚀.Reverse Image负片影像（阻剂）.Reverse Osmosis （RO）反（逆渗透）.Reversion反转,还原.Revision修正版.改订版.Rework（ing）重工,再加工.Rhology流变学,流变性质.Ribbon Cable圆线缆带.Rigid-Flex Printed Board硬软合板.Ring 套环.Rinsing水洗,冲洗.Ripple纹波（指整流器所输出电流中不稳定成分）.Rise Time上升时间.Roadmap 线路与零件之布局图.Robbe

12、r辅助阴极.Roller Coating辊轮涂布.Roller Coating滚动涂布法.Roller Cutter辊切机.Roller Tinning辊锡法,滚锡法.Rosin松香.Rotary Dip Test摆动沾锡试验.Routing切外型.Runout偏转,累绩距差.Rupture迸裂.*S*Sacrificial Protection牺牲性保护层.Salt Spray Test盐雾试验.Sand Blast喷砂.Saponification皂化作用.Saponifier皂化剂.Satin Finish缎面处理.Scaled Flow Test比例流量实验.Schemetic Dia

13、gram电路概略图.ScoringV型刻槽.Scratch刮痕.Screen Printing纲版印刷.Screenability纲印能力.Scrubber磨刷机,磨刷器.Scum透明残膜.Sealing封孔.Secondary Side第二面 .Seeding下种.Selective Plating选择性电镀.Self-Extinguishing自熄性.Selvage布边.Semi-Additive Process半加成制程.Semi-Conductor半导体.Sensitizing敏化.Separable Component Part可分离式零件.Separator Plate隔板, 钢板

14、.Sequential Lamination接续性压合法.Sequestering Agent螯合剂.Shadowing阴影,回蚀死角.Shank钻针柄部.Shear Strength 抗剪强度.Shelf Life储龄.Shield遮蔽.Shore Hardness萧氏硬度.Short短路.Shoulder Angle肩斜角.Shunt分路.Side Wall侧壁.Siemens电阻值.Sigma （Standard Deviation）标准差.Signal讯号.Silane硅烷.Silica Gel硅胶砂.Silicon硅.Silicone硅铜.Silk Screen纲版印刷,丝纲印刷.S

15、ilver Migration银迁移.Silver Paste 银膏.Single-In-Line Package（SIP）单边插脚封装体.Sintering烧结.Sizing上胶,上浆.Sizing上浆处理.Skin Effect集肤效应 （高频下,电流在传递时多集中在导体表面,使得道线内部通过电流甚少, 造成内部导体浪费,并也使得表面导体部分电阻升高.Skip Printing, Skip Plating漏印,漏镀.Skip Solder 缺锡, 漏焊.Slashing浆经.Sleeve Jint套接.Sliver边丝,边余.Slot, Slotting槽口.Sludge于泥.Slump塌

16、散.Slurry稠浆,悬浮浆.Small Hole小孔.Smear胶渣.Smudging锡点沾污.Snap-off弹回高度.Socket插座.Soft Contact轻触.Soft Glass 软质玻璃（铅玻璃）.Solder焊锡.Solder Ball锡球.Solder Bridging锡桥.Solder Bump 焊锡凸块.Solder Column Package锡柱脚封装法.Solder Connection焊接.Solder Cost焊锡着层.Solder Dam锡堤.Solder Fillet填锡.Solder Levelling喷锡,热风整平.Solder Masking（S/M

17、）防焊膜绿漆.Solder Paste锡膏.Solder Plug锡塞（柱）.Solder Preforms预焊料.Solder Projection焊锡突点.Solder Sag 焊锡垂流物.Solder Side焊锡面.Solder Spatter溅锡.Solder Splash贱锡.Solder Spread Test散锡试验.Solder Webbing锡纲.Solder Wicking渗锡,焊锡之灯芯效应.Solderability可焊性.Soldering软焊,焊接.Soldering Fluid, Soldering Oil助焊液,护焊油.Solid Content固体含量,固形

18、分.Solidus Line固相线.Spacing间距.Span跨距.Spark Over闪络.Specific Heat 比热.Specification （Spec）规范,规格.Specimen样品,试样.Spectrophotometry分光光度计检测法.Spindle主轴,钻轴.Spinning Coating自转涂布.Splay斜钻孔.Spray Coating喷着涂装.Spur底片图形边缘突出.Sputtering溅射.Squeege刮刀.Stagger Grid蹒跚格点.Stalagometer滴管式表面张力计.Stand-off Terminals直立型端子.Starvatio

19、n缺胶.Static Eliminator静电消除器.Steel Rule Die（钢）刀模.Stencil版膜.Step and Repeat逐次重复曝光.Step Plating梯阶式镀层.Step Tablet阶段式曝光表.Stiffener补强条（板）.Stop Off防镀膜, 阻剂.Strain变形,应变.Strand绞（指由许多股单丝集束并旋扭而成的丝束）.Stray Current迷走电流, 散杂电流（在电镀槽系统中,其直流电由整流器所提供,应在阳极板与被镀件之间的汇电杆与槽体液体中流通,但有时少部分电流也可能会从槽体本身或加热器上迷走,漏失）.Stress Corrosion应

20、力腐蚀.Stress Relief消除应力.Strike预镀.Stringing拖尾.Stripline条线.Stripper剥除液（器）.Substractive Process减成法.Substrate底材.Supper Solder超级焊锡.Supported Hole（金属）支助通孔.Surface Energy表面能.Surface Insulation Resistance表面绝缘电阻.Surface Mount Device 表面粘装组件.Surface Mounting Technology （SMT）表面粘装技术.Surface Resistivity表面电阻率.Surfac

21、e Speed钻针表面速度.Surface Tension表面张力.Surfactant表面润湿剂.Surge突流,突压.Swaged Lead压扁式引脚.Swelling Agents, Sweller膨松剂.Swimming 线路滑离.Synthetic Resin合成树脂.*T*Tab接点,金手指.Taber Abraser泰伯磨试器.Tackiness粘着性, 粘手性.Tape Automatic Bonding （TAB）卷带自动结合.Tape Casting 带状铸材.Tape Test撕胶带试验.Tape Up Master原始手贴片.Taped Components卷带式连载组

22、件.Taper Pin Gauge锥状孔规.Tarnish污化.Tarnish 污化, 污着.Teflon铁氟龙（聚4氟乙烯）.Telegraphing浮印,隐印.Temperature Profile温度曲线.Template模板.Tensile Strength抗拉强度.Tensiomenter张力计.Tenting盖孔法.Terminal端子.Terminal Clearance端子空环.Tetra-Etch氟树脂蚀粗剂.Tetrafunctional Resin四功能树脂.Thermal Coefficient of Expansion （TCE）热膨胀系数.Thermal Condu

23、ctivity导热率.Thermal Cycling热循环,热震荡.Thermal Mismstch感热失谐.Thermal Relief散热式镂空.Thermal Via导热孔.Thermal Zone感热区.Thermocompression Bonding热压结合.Thermocouple热电偶.Thermode发热体.Thermode Soldering热模焊接法.Thermogravimetric Analysis, （TGA）热重分析法.Thermomechanical Analysis （TMA）热机分析法.Thermoplastic热塑性.Thermosetting热固性.Th

24、ermosonic Bonding热超音波结合.Thermount聚醯胺短纤席材.Thermo-Via导热孔.Thick Film Circuit厚膜电路.Thief辅助阳极.Thin Copper Foil薄铜箔.Thin Core薄基板.Thin Film Technology薄膜技术.Thin Small Outline Package（TSOP）薄小型绩体电路器.Thinner调薄剂.Thixotropy抗垂流性,摇变性.Three Point Bending三点压弯试验.Three-Layer Carrier三层式载体.Threshold Limit Value （TLV）极限值.T

25、hrough Hole Mounting通孔插装.Through Put物流量,物料通过量.Throwing Power分布力.Tie Bar分流条.Tin Drift锡量漂飘失.Tin Immersion浸镀锡.Tin Pest锡疫（常见白色金属锡为锡,当温度低于13.2时则锡将逐渐转变成粉末状灰色锡称为锡疫.Tin Whishers锡须.Tinning热沾焊锡.Tolerance公差.Tombstoning墓碑效应.Tooling Feature工具标示物.Topography表面地形.Torsion Strength抗扭强度.Touch Up触修,简修.Trace 线路,导线.Trace

26、ability追溯性,可溯性.Transducer转能器.Transfer Bump移用式突块.Transfer Laminatied Circuit转压式线路.Transfer Soldering移焊法.Transistor晶体管.Translucency半透性.Transmission Line传输线.Transmittance透光率.Treament, Treating含浸处理.Treeing枝状镀物,镀须.Trim修整, 精修.Trim Line裁切线.Trimming修整,修边.True Position真位.Tungsten钨Tungsten Carbide碳化钨.Turnkey System包办式系统.Turret Solder Terminal塔立式焊接端子.Twill Weave斜织法.Twist板扭.Two Layer Carrier两层式载体.*U*UL Symbol（UL.为Under-Writers 保俭业试验所标志.Laboratories,INC）Ultimate Tensile Strength （UTS）极限抗拉强度.Ultra High Frequency （UHF）超高频率.Ultra