电路板中英文专业术语词汇NZWord下载.docx
《电路板中英文专业术语词汇NZWord下载.docx》由会员分享，可在线阅读，更多相关《电路板中英文专业术语词汇NZWord下载.docx（14页珍藏版）》请在冰点文库上搜索。
Outgassing出气,吹气.
Outgrowth悬出,横出,侧出.
Output产出,输出.
Overflow溢流.
Overhang总悬空.
Overlap钻尖点分离.
Overpotantial（Overvoltage）过电位,过电压.
Oxidation氧化.
OxygenInhibitor氧化抑制剂.
OzoneDepletion臭氧层耗损.
*****P*****
Packaging封装,构装.
Pad焊垫,圆垫.
PadMaster圆垫底片.
PadsOnlyBoard唯垫板.
Palladium钯.
Panel制程板.
PanelPlating全板镀铜.
PanelProcess全板电镀法.
PaperPhenolic纸质酚醛树脂（板材）.
PartingAgent脱膜剂.
Passivation钝化,钝化外理.
PassiveDevice（Component）被动组件（零件）
Paste膏,糊.
Pattern板面图形.
PatternPlating线路电镀.
PatternProcess线路电镀法.
PeakVoltage峰值电压.
PeelStrength抗撕强度.
PeriodicReverse（PR）Current周期性反电流.
Peripheral周边附属设备.
Permeability透气性,导磁率.
Permittivity诱电率,透电率.
pHValue酸碱值.
Phase相.
PhaseDiagram相图.
Phenolic酚醛树脂.
Photofugitive感光褪色.
Photographicfilm感光成像之底片.
Photoinitiator感光启始剂.
Photomask光罩.
Photoplotter,Plotter光学绘图机.
Photoresist光阻.
PhotoresistChemicalMachinning（Milling）光阻式化学（铣刻）加工.
Phototool底片.
PickandPlace拾取与放置.
Piezoelectric压电性.
Pin插脚,插梢,插针.
PinGridArray（PGA）矩阵式针脚对装.
Pinhole针孔.
PinkRing粉红圈.
Pitch跨距,脚距,垫距,线距.
Pits凹点.
PlainWeave平织.
Plasma电浆.
Plasticizers可塑剂,增塑剂.
PlatedThroughHole镀通孔.
Platen热盘.
Plating镀.
Plotting标绘.
Plowing犁沟.
Plug插脚,塞柱.
Ply层,股.
PneumaticStretcher气动拉伸器.
PogoPin伸缩探针.
Point钻尖.
PointAngle钻尖面.
PointSourceLight点状光源.
Poise泊."
粘滞度"
单位=1dyne*sec/cm2.
PolarSolvent极性溶剂.
Polarity电极性.
Polarization分极,极化.
PolarizingSlot偏槽.
PolyesterFilms聚酯类薄片.
PolymerThickFilm（PTF）厚膜糊.
Polymerization聚合.
Polymide（PI）聚亚醯胺.
PopcornEffect爆米花效应.
Porcelain瓷材,瓷面.
PorosityTest疏孔度试验.
PositiveActingResist正性光阻剂.
PostCure后续硬化,后烤.
PostSeparation后期分离,事后公离.
PotLife运用期,锅中寿命.
Potting铸封,模封.
PowerSupply电源供应器.
Preform预制品.
Preheat预热.
Prepreg胶片,树脂片.
PressPlate钢板.
Press-FitContact挤入式接触.
PressureFoot压力脚.
Pre-tinning预先沾锡.
PrimaryImage线路成像.
PrintThrough压透,过度挤压..
Probe探针.
ProcessCamera制程用照像机.
ProcessWindow操作范围.
ProductionMaster生产底片.
Profile轮廓,部面图,升温曲线图棱线.
Propagation传播.
PropagationDelay传播延迟.
PuddleEffect水坑效应.
PullAway拉离.
PulsePlating脉冲电镀法.
PumicePowder浮石粉.
Punch冲切.
Purge,Purging净空,净洗.
PurplePlague紫疫（金与铝的共化物层）.
Pyrolysis热裂解,高温分解.
*****Q*****
QuadFlatPack（QFP）方扁形封装体.
QualificationAgency资格认证机构.
QualificationInspection资格检验.
QualifiedProductsList合格产品（供应者）名单.
QualitativeAnalysis定性分析.
QualityConformanceTestCircuitry（Coupon）品质符合之试验线路（样板）.
QuantitativeAnalysis定量分析.
Quench淬火,骤冷.
QuickDisconnect快速接头.
Quill纬纱绕轴.
*****R*****
Rack挂架.
RadialLead放射状引脚.
RadioFrequencyInterference（RFI）射频干扰.
RakeAngle抠角,耙角.
RatedTemperature,Voltage额定温度,额定电压.
Reactance电抗.
RealEstate底材面,基板面.
RealTimeSystem实时系统.
Reclaiming再生,再制.
Rediometer辐射计,光度计.
ReeltoReel卷轮（盘）式操作.
ReferenceDimension参考尺度.
ReferenceEdge参考边缘.
Reflection反射.
ReflowSoldering重熔焊接,熔焊.
Refraction折射.
RefractiveIndex折射率.
RegisterMark对准用标记.
Registration对准度.
Reinforcement补强物.
Rejection剔退,拒收.
Relamination（Re-Lam）多层板压合.
Relaxation松弛.缓和.
Relay继电器.
ReleaseAgent,ReleaseSheets脱模剂,离模剂.
Reliability可靠度,可信度.
ReliefAngle浮角.
Repair修理.
ResinCoatedCopperFoil背胶铜箔.
ResinContent胶含量,树脂含量.
ResinFlow胶流量,树脂流量.
ResinRecession树脂下陷.
ResinRichArea多胶区,树脂丰富区.
ResinSmear胶（糊）渣.
ResinStarveArea缺胶区,树脂缺乏区.
Resist阻膜,阻剂.
Resistivity电阻系数,电阻率.
Resistor电阻器,电阻.
ResistorDrift电阻漂移.
ResistorPaste电阻印膏.
Resolution解像,解像度,分辨率.
ResolvingPower解析（像）力,分辨力.
ReverseCurrentCleaning反电流（电解）清洗.
ReverseEtchback反回蚀.
ReverseImage负片影像（阻剂）.
ReverseOsmosis（RO）反（逆渗透）.
Reversion反转,还原.
Revision修正版.改订版.
Rework（ing）重工,再加工.
Rhology流变学,流变性质.
RibbonCable圆线缆带.
Rigid-FlexPrintedBoard硬软合板.
Ring套环.
Rinsing水洗,冲洗.
Ripple纹波（指整流器所输出电流中不稳定成分）.
RiseTime上升时间.
Roadmap线路与零件之布局图.
Robber辅助阴极.
RollerCoating辊轮涂布.
RollerCoating滚动涂布法.
RollerCutter辊切机.
RollerTinning辊锡法,滚锡法.
Rosin松香.
RotaryDipTest摆动沾锡试验.
Routing切外型.
Runout偏转,累绩距差.
Rupture迸裂.
*****S*****
SacrificialProtection牺牲性保护层.
SaltSprayTest盐雾试验.
SandBlast喷砂.
Saponification皂化作用.
Saponifier皂化剂.
SatinFinish缎面处理.
ScaledFlowTest比例流量实验.
SchemeticDiagram电路概略图.
ScoringV型刻槽.
Scratch刮痕.
ScreenPrinting纲版印刷.
Screenability纲印能力.
Scrubber磨刷机,磨刷器.
Scum透明残膜.
Sealing封孔.
SecondarySide第二面.
Seeding下种.
SelectivePlating选择性电镀.
Self-Extinguishing自熄性.
Selvage布边.
Semi-AdditiveProcess半加成制程.
Semi-Conductor半导体.
Sensitizing敏化.
SeparableComponentPart可分离式零件.
SeparatorPlate隔板,钢板.
SequentialLamination接续性压合法.
SequesteringAgent螯合剂.
Shadowing阴影,回蚀死角.
Shank钻针柄部.
ShearStrength抗剪强度.
ShelfLife储龄.
Shield遮蔽.
ShoreHardness萧氏硬度.
Short短路.
ShoulderAngle肩斜角.
Shunt分路.
SideWall侧壁.
Siemens电阻值.
Sigma（StandardDeviation）标准差.
Signal讯号.
Silane硅烷.
SilicaGel硅胶砂.
Silicon硅.
Silicone硅铜.
SilkScreen纲版印刷,丝纲印刷.
SilverMigration银迁移.
SilverPaste银膏.
Single-In-LinePackage（SIP）单边插脚封装体.
Sintering烧结.
Sizing上胶,上浆.
Sizing上浆处理.
SkinEffect集肤效应（高频下,电流在传递时多集中在导体
表面,使得道线内部通过电流甚少,造成内部导体
浪费,并也使得表面导体部分电阻升高.
SkipPrinting,SkipPlating漏印,漏镀.
SkipSolder缺锡,漏焊.
Slashing浆经.
SleeveJint套接.
Sliver边丝,边余.
Slot,Slotting槽口.
Sludge于泥.
Slump塌散.
Slurry稠浆,悬浮浆.
SmallHole小孔.
Smear胶渣.
Smudging锡点沾污.
Snap-off弹回高度.
Socket插座.
SoftContact轻触.
SoftGlass软质玻璃（铅玻璃）.
Solder焊锡.
SolderBall锡球.
SolderBridging锡桥.
SolderBump焊锡凸块.
SolderColumnPackage锡柱脚封装法.
SolderConnection焊接.
SolderCost焊锡着层.
SolderDam锡堤.
SolderFillet填锡.
SolderLevelling喷锡,热风整平.
SolderMasking（S/M）防焊膜绿漆.
SolderPaste锡膏.
SolderPlug锡塞（柱）.
SolderPreforms预焊料.
SolderProjection焊锡突点.
SolderSag焊锡垂流物.
SolderSide焊锡面.
SolderSpatter溅锡.
SolderSplash贱锡.
SolderSpreadTest散锡试验.
SolderWebbing锡纲.
SolderWicking渗锡,焊锡之灯芯效应.
Solderability可焊性.
Soldering软焊,焊接.
SolderingFluid,SolderingOil助焊液,护焊油.
SolidContent固体含量,固形分.
SolidusLine固相线.
Spacing间距.
Span跨距.
SparkOver闪络.
SpecificHeat比热.
Specification（Spec）规范,规格.
Specimen样品,试样.
Spectrophotometry分光光度计检测法.
Spindle主轴,钻轴.
SpinningCoating自转涂布.
Splay斜钻孔.
SprayCoating喷着涂装.
Spur底片图形边缘突出.
Sputtering溅射.
Squeege刮刀.
StaggerGrid蹒跚格点.
Stalagometer滴管式表面张力计.
Stand-offTerminals直立型端子.
Starvation缺胶.
StaticEliminator静电消除器.
SteelRuleDie（钢）刀模.
Stencil版膜.
StepandRepeat逐次重复曝光.
StepPlating梯阶式镀层.
StepTablet阶段式曝光表.
Stiffener补强条（板）.
StopOff防镀膜,阻剂.
Strain变形,应变.
Strand绞（指由许多股单丝集束并旋扭而成的丝束）.
StrayCurrent迷走电流,散杂电流（在电镀槽系统中,其直流电
由整流器所提供,应在阳极板与被镀件之间的汇
电杆与槽体液体中流通,但有时少部分电流也可能会
从槽体本身或加热器上迷走,漏失）.
StressCorrosion应力腐蚀.
StressRelief消除应力.
Strike预镀.
Stringing拖尾.
Stripline条线.
Stripper剥除液（器）.
SubstractiveProcess减成法.
Substrate底材.
SupperSolder超级焊锡.
SupportedHole（金属）支助通孔.
SurfaceEnergy表面能.
SurfaceInsulationResistance表面绝缘电阻.
SurfaceMountDevice表面粘装组件.
SurfaceMountingTechnology（SMT）表面粘装技术.
SurfaceResistivity表面电阻率.
SurfaceSpeed钻针表面速度.
SurfaceTension表面张力.
Surfactant表面润湿剂.
Surge突流,突压.
SwagedLead压扁式引脚.
SwellingAgents,Sweller膨松剂.
Swimming线路滑离.
SyntheticResin合成树脂.
*****T*****
Tab接点,金手指.
TaberAbraser泰伯磨试器.
Tackiness粘着性,粘手性.
TapeAutomaticBonding（TAB）卷带自动结合.
TapeCasting带状铸材.
TapeTest撕胶带试验.
TapeUpMaster原始手贴片.
TapedComponents卷带式连载组件.
TaperPinGauge锥状孔规.
Tarnish污化.
Tarnish污化,污着.
Teflon铁氟龙（聚4氟乙烯）.
Telegraphing浮印,隐印.
TemperatureProfile温度曲线.
Template模板.
TensileStrength抗拉强度.
Tensiomenter张力计.
Tenting盖孔法.
Terminal端子.
TerminalClearance端子空环.
Tetra-Etch氟树脂蚀粗剂.
TetrafunctionalResin四功能树脂.
ThermalCoefficientofExpansion（TCE）热膨胀系数.
ThermalConductivity导热率.
ThermalCycling热循环,热震荡.
ThermalMismstch感热失谐.
ThermalRelief散热式镂空.
ThermalVia导热孔.
ThermalZone感热区.
ThermocompressionBonding热压结合.
Thermocouple热电偶.
Thermode发热体.
ThermodeSoldering热模焊接法.
ThermogravimetricAnalysis,（TGA）热重分析法.
ThermomechanicalAnalysis（TMA）热机分析法.
Thermoplastic热塑性.
Thermosetting热固性.
ThermosonicBonding热超音波结合.
Thermount聚醯胺短纤席材.
Thermo-Via导热孔.
ThickFilmCircuit厚膜电路.
Thief辅助阳极.
ThinCopperFoil薄铜箔.
ThinCore薄基板.
ThinFilmTechnology薄膜技术.
ThinSmallOutlinePackage（TSOP）薄小型绩体电路器.
Thinner调薄剂.
Thixotropy抗垂流性,摇变性.
ThreePointBending三点压弯试验.
Three-LayerCarrier三层式载体.
ThresholdLimitValue（TLV）极限值.
ThroughHoleMounting通孔插装.
ThroughPut物流量,物料通过量.
ThrowingPower分布力.
TieBar分流条.
TinDrift锡量漂飘失.
TinImmersion浸镀锡.
TinPest锡疫（常见白色金属锡为"
β锡"
当温度低于13.2℃
时则β锡将逐渐转变成粉末状灰色"
α锡"
称为"
锡疫"
.
TinWhishers锡须.
Tinning热沾焊锡.
Tolerance公差.
Tombstoning墓碑效应.
ToolingFeature工具标示物.
Topography表面地形.
TorsionStrength抗扭强度.
TouchUp触修,简修.
Trace线路,导线.
Traceability追溯性,可溯性.
Transducer转能器.
TransferBump移用式突块.
TransferLaminatiedCircuit转压式线路.
TransferSoldering移焊法.
Transistor晶体管.
Translucency半透性.
TransmissionLine传输线.
Transmittance透光率.
Treament,Treating含浸处理.
Treeing枝状镀物,镀须.
Trim修整,精修.
TrimLine裁切线.
Trimming修整,修边.
TruePosition真位.
Tungsten钨
TungstenCarbide碳化钨.
TurnkeySystem包办式系统.
TurretSolderTerminal塔立式焊接端子.
TwillWeave斜织法.
Twist板扭.
TwoLayerCarrier两层式载体.
*****U*****
ULSymbol（UL.为Under-Writers保俭业试验所标志.
Laboratories,INC）
UltimateTensileStrength（UTS）极限抗拉强度.
UltraHighFrequency（UHF）超高频率.
Ultra
升级会员 