1、印制电路板相关英语词汇一 综合词汇印制电路:printed circuit印制线路:printed wiring印制板:printed board印制板电路:printed circuit board (PCB)印制线路板:printed wiring board(PWB)印制元件:printed component印制接点:printed contact印制板装配:printed board assembly板:board单面印制板:single-sided printed board(SSB)双面印制板:double-sided printed board(DSB)多层印制板:mulitl
2、ayer printed board(MLB)多层印制电路板:mulitlayer printed circuit board多层印制线路板:mulitlayer prited wiring board刚性印制板:rigid printed board刚性单面印制板:rigid single-sided printed borad刚性双面印制板:rigid double-sided printed borad刚性多层印制板:rigid multilayer printed board挠性多层印制板:flexible multilayer printed board挠性印制板:flexible
3、printed board挠性单面印制板:flexible single-sided printed board挠性双面印制板:flexible double-sided printed board挠性印制电路:flexible printed circuit (FPC)挠性印制线路:flexible printed wiring刚性印制板:flex-rigid printed board, rigid-flex printed board刚性双面印制板:flex-rigid double-sided printed board, rigid-flex double-sided printed
4、刚性多层印制板:flex-rigid multilayer printed board, rigid-flex multilayer printed board齐平印制板:flush printed board金属芯印制板:metal core printed board金属基印制板:metal base printed board多重布线印制板:mulit-wiring printed board陶瓷印制板:ceramic substrate printed board导电胶印制板:electroconductive paste printed board模塑电路板:molded circu
5、it board模压印制板:stamped printed wiring board顺序层压多层印制板:sequentially-laminated mulitlayer散线印制板:discrete wiring board微线印制板:micro wire board积层印制板:buile-up printed board积层多层印制板:build-up mulitlayer printed board (BUM)积层挠印制板:build-up flexible printed board表面层合电路板:surface laminar circuit (SLC)埋入凸块连印制板:B2it pr
6、inted board多层膜基板:multi-layered film substrate(MFS)层间全内导通多层印制板:ALIVH multilayer printed board载芯片板:chip on board (COB)埋电阻板:buried resistance board母板:mother board子板:daughter board背板:backplane裸板:bare board键盘板夹心板:copper-invar-copper board动态挠性板:dynamic flex board静态挠性板:static flex board可断拼板:break-away plan
7、el电缆:cable挠性扁平电缆:flexible flat cable (FFC)薄膜开关:membrane switch混合电路:hybrid circuit厚膜:thick film厚膜电路:thick film circuit薄膜:thin film薄膜混合电路:thin film hybrid circuit互连:interconnection导线:conductor trace line齐平导线:flush conductor传输线:transmission line跨交:crossover板边插头:edge-board contact增强板:stiffener基底:substra
8、te基板面:real estate导线面:conductor side元件面:component side焊接面:solder side印制:printing网格:grid图形:pattern导电图形:conductive pattern非导电图形:non-conductive pattern字符:legend标志:mark二 基材:基材:base material层压板:laminate覆金属箔基材:metal-clad bade material覆铜箔层压板:copper-clad laminate (CCL)单面覆铜箔层压板:single-sided copper-clad lamina
9、te双面覆铜箔层压板:double-sided copper-clad laminate复合层压板:composite laminate薄层压板:thin laminate金属芯覆铜箔层压板:metal core copper-clad laminate金属基覆铜层压板:metal base copper-clad laminate挠性覆铜箔绝缘薄膜:flexible copper-clad dielectric film基体材料:basis material预浸材料:prepreg粘结片:bonding sheet预浸粘结片:preimpregnated bonding sheer环氧玻璃基
10、板:epoxy glass substrate加成法用层压板:laminate for additive process预制内层覆箔板:mass lamination panel内层芯板:core material催化板材:catalyzed board ,coated catalyzed laminate涂胶催化层压板:adhesive-coated catalyzed laminate涂胶无催层压板:adhesive-coated uncatalyzed laminate粘结层:bonding layer粘结膜:film adhesive涂胶粘剂绝缘薄膜:adhesive coated d
11、ielectric film无支撑胶粘剂膜:unsupported adhesive film覆盖层:cover layer (cover lay)增强板材:stiffener material铜箔面:copper-clad surface去铜箔面:foil removal surface层压板面:unclad laminate surface基膜面:base film surface胶粘剂面:adhesive faec原始光洁面:plate finish粗面:matt finish纵向:length wise direction模向:cross wise direction剪切板:cut t
12、o size panel酚醛纸质覆铜箔板:phenolic cellulose paper copper-clad laminates(phenolic/paper CCL)环氧纸质覆铜箔板:epoxide cellulose paper copper-clad laminates (epoxy/paper CCL)环氧玻璃布基覆铜箔板:epoxide woven glass fabric copper-clad laminates环氧玻璃布纸复合覆铜箔板:epoxide cellulose paper core, glass cloth surfaces copper-clad lamina
13、tes环氧玻璃布玻璃纤维复合覆铜箔板:epoxide non woven/woven glass reinforced copper-clad laminates聚酯玻璃布覆铜箔板:ployester woven glass fabric copper-clad laminates聚酰亚胺玻璃布覆铜箔板:polyimide woven glass fabric copper-clad laminates双马来酰亚胺三嗪环氧玻璃布覆铜箔板:bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates环氧合成纤维布覆铜
14、箔板:epoxide synthetic fiber fabric copper-clad laminates聚四乙烯玻璃纤维覆铜箔板:teflon/fiber glass copper-clad laminates超薄型层压板:ultra thin laminate陶瓷基覆铜箔板:ceramics base copper-clad laminates紫外线阻挡型覆铜箔板:UV blocking copper-clad laminates三 基材的材料A阶树脂:A-stage resinB阶树脂:B-stage resinC阶树脂:C-stage resin环氧树脂:epoxy resin酚醛
15、树脂:phenolic resin聚酯树脂:polyester resin聚酰亚胺树脂:polyimide resin双马来酰亚胺三嗪树脂:bismaleimide-triazine resin丙烯酸树脂:acrylic resin三聚氰胺甲醛树脂:melamine formaldehyde resin多官能环氧树脂:polyfunctional epoxy resin溴化环氧树脂:brominated epoxy resin环氧酚醛:epoxy novolac氟树脂:fluroresin硅树脂:silicone resin硅烷:silane聚合物:polymer无定形聚合物:amorphou
16、s polymer结晶现象:crystalline polamer双晶现象:dimorphism共聚物:copolymer合成树脂:synthetic热固性树脂:thermosetting resin热塑性树脂:thermoplastic resin感光性树脂:photosensitive resin环氧当量:weight per epoxy equivalent (WPE)环氧值:epoxy value双氰胺:dicyandiamide粘结剂:binder胶粘剂:adesive固化剂:curing agent阻燃剂:flame retardant遮光剂:opaquer增塑剂:plastici
17、zers不饱和聚酯:unsatuiated polyester聚酯薄膜:polyester聚酰亚胺薄膜:polyimide film (PI)聚四氟乙烯:polytetrafluoetylene (PTFE)聚全氟乙烯丙烯薄膜:perfluorinated ethylene-propylene copolymer film (FEP)增强材料:reinforcing material玻璃纤维:glass fiberE玻璃纤维:E-glass fibreD玻璃纤维:D-glass fibreS玻璃纤维:S-glass fibre玻璃布:glass fabric非织布:non-woven fabr
18、ic玻璃纤维垫:glass mats纱线:yarn单丝:filament绞股:strand纬纱:weft yarn经纱:warp yarn但尼尔:denier经向:warp-wise纬向:weft-wise, filling-wise织物经纬密度:thread count织物组织:weave structure平纹组织:plain structure坏布:grey fabric稀松织物:woven scrim弓纬:bow of weave断经:end missing缺纬:mis-picks纬斜:bias折痕:crease云织:waviness鱼眼:fish eye毛圈长:feather len
19、gth厚薄段:mark裂缝:split捻度:twist of yarn浸润剂含量:size content浸润剂残留量:size residue处理剂含量:finish level浸润剂:size偶联剂:couplint agent处理织物:finished fabric聚酰胺纤维:polyarmide fiber聚酯纤维非织布:non-woven polyester fabric浸渍绝缘纵纸:impregnating insulation paper聚芳酰胺纤维纸:aromatic polyamide paper断裂长:breaking length吸水高度:height of capill
20、ary rise湿强度保留率:wet strength retention白度:whitenness陶瓷:ceramics导电箔:conductive foil铜箔:copper foil电解铜箔:electrodeposited copper foil (ED copper foil)压延铜箔:rolled copper foil退火铜箔:annealed copper foil压延退火铜箔:rolled annealed copper foil (RA copper foil)薄铜箔:thin copper foil涂胶铜箔:adhesive coated foil涂胶脂铜箔:resin
21、coated copper foil (RCC)复合金属箔:composite metallic material载体箔:carrier foil殷瓦:invar箔(剖面)轮廓:foil profile光面:shiny side粗糙面:matte side处理面:treated side防锈处理:stain proofing双面处理铜箔:double treated foil四 设计原理图:shematic diagram逻辑图:logic diagram印制线路布设:printed wire layout布设总图:master drawing可制造性设计:design-for-manufac
22、turability计算机辅助设计:computer-aided design.(CAD)计算机辅助制造:computer-aided manufacturing.(CAM)计算机集成制造:computer integrat manufacturing.(CIM)计算机辅助工程:computer-aided engineering.(CAE)计算机辅助测试:computer-aided test.(CAT)电子设计自动化:electric design automation .(EDA)工程设计自动化:engineering design automaton .(EDA2)组装设计自动化:as
23、sembly aided architectural design. (AAAD)计算机辅助制图:computer aided drawing计算机控制显示:computer controlled display .(CCD)布局:placement布线:routing布图设计:layout重布:rerouting模拟:simulation逻辑模拟:logic simulation电路模拟:circit simulation时序模拟:timing simulation模块化:modularization布线完成率:layout effeciency机器描述格式:machine descript
24、ionm format .(MDF)机器描述格式数据库:MDF databse设计数据库:design database设计原点:design origin优化(设计):optimization (design)供设计优化坐标轴:predominant axis表格原点:table origin镜像:mirroring驱动文件:drive file中间文件:intermediate file制造文件:manufacturing documentation队列支撑数据库:queue support database元件安置:component positioning图形显示:graphics d
25、isplay比例因子:scaling factor扫描填充:scan filling矩形填充:rectangle filling填充域:region filling实体设计:physical design逻辑设计:logic design逻辑电路:logic circuit层次设计:hierarchical design自顶向下设计:top-down design自底向上设计:bottom-up design线网:net数字化:digitzing设计规则检查:design rule checking走(布)线器:router (CAD)网络表:net list计算机辅助电路分析:compute
26、r-aided circuit analysis子线网:subnet目标函数:objective function设计后处理:post design processing (PDP)交互式制图设计:interactive drawing design费用矩阵:cost metrix工程图:engineering drawing方块框图:block diagram迷宫:moze元件密度:component density巡回售货员问题:traveling salesman problem自由度:degrees freedom入度:out going degree出度:incoming degre
27、e曼哈顿距离:manhatton distance欧几里德距离:euclidean distance网络:network阵列:array段:segment逻辑:logic逻辑设计自动化:logic design automation分线:separated time分层:separated layer定顺序:definite sequence五 形状及尺寸:导线(通道):conduction (track)导线(体)宽度:conductor width导线距离:conductor spacing导线层:conductor layer导线宽度/间距:conductor line/space第一导
28、线层:conductor layer No.1圆形盘:round pad方形盘:square pad菱形盘:diamond pad长方形焊盘:oblong pad子弹形盘:bullet pad泪滴盘:teardrop pad雪人盘:snowman padV形盘:V-shaped pad环形盘:annular pad非圆形盘:non-circular pad隔离盘:isolation pad非功能连接盘:monfunctional pad偏置连接盘:offset land腹(背)裸盘:back-bard land盘址:anchoring spaur连接盘图形:land pattern连接盘网格阵
29、列:land grid array孔环:annular ring元件孔:component hole安装孔:mounting hole支撑孔:supported hole非支撑孔:unsupported hole导通孔:via镀通孔:plated through hole (PTH)余隙孔:access hole盲孔:blind via (hole)埋孔:buried via hole埋/盲孔:buried /blind via任意层内部导通孔:any layer inner via hole (ALIVH)全部钻孔:all drilled hole定位孔:toaling hole无连接盘孔:
30、landless hole中间孔:interstitial hole无连接盘导通孔:landless via hole引导孔:pilot hole端接全隙孔:terminal clearomee hole准表面间镀覆孔:quasi-interfacing plated-through hole准尺寸孔:dimensioned hole在连接盘中导通孔:via-in-pad孔位:hole location孔密度:hole density孔图:hole pattern钻孔图:drill drawing装配图:assembly drawing印制板组装图:printed board assembly drawing参考基准:datum referan
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