电路板PCB工程师英文EQ整理.docx
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电路板PCB工程师英文EQ整理
1基本信息
(1)问题:
theboardthickness(2.36+/-0.05mm)istoohardtocontrolforus
对我们来说,板厚2.36+/-0.05mm太难管控
建议:
Canwecontrolthefinishedboardthicknessas2.4+/-10%mm?
Pleasecomfirm!
请确认我们可否控制完成板厚为2.4+/-10%mm?
(2)问题:
Asshowinfigure,manufacturingrequirementsspecification,using17um(1/2oz)basedcopper,finishedsurfacecopper:
46um(0.00181");itisdifferentfromwhatshows1ozforstackup.
如下图所示,制作说明要求使用17um基铜,完成铜厚46um.这跟叠构中的1OZ铜厚不符.
建议:
Use1ozbasedcopper,finishedsurfacecopper:
46um(0.00181")
使用1oz基铜,完成铜厚46um.
(3)问题:
Asshowinthebelowfigure,outercopperis1oz..Wecan’tmakesurewhetherthefinishedsurfacecopperis1oz.
如下图所示,外层铜厚为1OZ,我们不能确定完成铜厚是否为1OZ.
建议:
UsingHozbasecopper,finishedsurface1ozcopper;
使用Hoz基铜,成品铜厚为1oz.
(4)问题:
Thestack-upyourcompanyprovideddidnotconformtherequirementsofimpedance,andtheinnerlayersneedtouse3Pre-preg.
贵司提供的叠构不符合阻抗要求,且层需要用3pp
建议:
AdjustthethicknessofthePre-pregandthecore。
Seebelow.
调整芯板和PP的厚度,见下图
(5)问题:
Themake-uplikeastheattachment(12PCS/PNL),inordertosavethecosting,pleaseconfirmifcanaccept3X-OUTperpanel?
如附件所示拼版(12pcs/PNL),为了节约成本,请确认可否接受每个拼版有3个打叉板?
建议:
Accepted3X-OUTperpanel,butnotexceed5%oforderquantity.Andpackthemseparatelywhenshipping.
接受每拼版出3个打叉板,但不超过总订单数的5%,且出货时把打叉板分开包装.
(6)问题:
Asshowinfigure,Yourcompanyrequirementsaccordingtolevel3standardcontrols,thisrequirementistoohardtocontrolforus
如下图所示,贵司要求按3级标准管控,我们较难管控.
建议:
Controlledbylevel2standardproduction.
按2级标准管控生产.
(7)Pleaseconfirmtheattachedpaneldrawing.
请确认附件拼版图
(8)Aboveisoursuggestedstackup,pleaseconfirm.
上图为我司建议叠构,请确认.
(9)问题:
Yourcompanyhavenotprovidedthetoleranceofboardthickness,pleaseconfirmwhetherwecouldcontrolitas1.6mm+/-10%?
贵司没有提供板厚公差,请确认我司可否按1.6mm+/-10%来管控?
(10)问题:
Wecan'tfindthefinishcopperthicknessandsoldermaskcolorinspec,pleaseprovide.
我们在说明书中找不到完成铜厚和防焊颜色,请提供.
建议:
Finishcopperthickness:
1oz,SMcolor:
mattegreen
完成铜厚1OZ防焊颜色:
哑光绿色
(11)问题:
PleaseseeFig1,thenumberingerberisdifferentfrom"HIT-20-001200-001"inspec.
请看图一,gerber中的料号跟说明书中的"HIT-20-001200-001"不相符.
建议:
Wewillignorethisdifferenceandfollowthegerberfiletoproducethisboard.
我们将忽略这个不同点,然后按照gerber来制作.
(12)问题:
ThecustomerrequiresuseFR-402material,butwehavenotthiskindofsheetmaterial.客户要求使用FR-402板材,但我们没有这种板材.
建议:
Wewilluseourcommonmaterialproduction,Pleaseconfirm!
LikeKB6160orequivalentinsteadofFR-402.
我们将使用常用的板材生产,请确认.像KB6160或同等级的板材来代替FR-402.
(13)问题:
Inordertoavoidthepanelboardscrapedinprocess,wewouldliketochangethesharpcornertoroundangleasR1.0mm.
为了避免板子在生产过程中刮花,我们将尖的角倒角为R1.0mm的角.
(14)问题:
Seebelowfigure,50Ohmimpedanceiscontrolledinthegerber,but
theindicatedthathadnocontrolledimpedance;Actually,thecalculationalsocannotreach50Ohmimpedancevalues.见下图,gerber中要求做50ohm阻抗控制,但中说明不用做阻抗控制。
事实上也达不到50ohm阻抗值.
建议:
Ignoretheimpedancecontrol.
忽略阻抗控制.
(15)问题:
Thereisno60milcoreonourstore,wewilladjustthestackupasbelowfig.Bshow.我们仓库没有60mil的芯板,我们将调整叠构,如图B所示.
(16)问题:
Itistoohardtokeepconductorwidthsandspacingwithin15%ofdataforus.
要将线宽距控制在+/-15%,对我们来说太难了
建议:
Wesuggesttorelaxitas+/-20%toprocess.
我们建议放宽到+/-20%
(17)问题:
Youdonotspecifytheinceptstandard.WewillfollowIPC-A-600GClass2andIPC-6012BClass2tobuildthisboard.
贵司没有指明验收标准,我们将根据IPC2级标准来生产板子.
(18)问题:
Itdoesn’tspecifythicknessofNiandAu.
没有说明镍和金的厚度.
建议:
Wewillcontrolas:
Ni:
3-6umminandAu≥0.05um
我们将管控为:
镍最少3-6um,金≥0.05um
(19)问题:
Wecan’tinputthefourfiles(seebelowfig.)byoursoftware
用我们的软件打不开下图的4个文件.
建议:
Wewillignorethefourfiles.
我们将忽略这4个文件.
(20)问题:
Wearenotsurethesurfacefinishofthisboard,becausetherequirementoftwofilesaredifferent.(Seebelowpictures.)
我们不能确定这个板的表面处理,因为2个文件的要求不同.(见下图)
建议:
Wewillfollowimmersiongoldtoproduce.(Au:
0.05um(min),Ni:
3-6um)
我们将按沉金制作.(金厚最少0.05um,镍厚3-6um)
(21)问题:
Pleaseseebelowpicture,thedimensionbetweenthegerberandthedrawingisdifferent.请看下图,图纸和gerber的尺寸不一样.
建议:
Wewillfollowgerberfiletoproduce.
我们将依gerber制作.
(22)问题:
Wedon’tknowtheusageofthesefile,andwethinkthemhavenothingtodoforPCBmanufacture.我们不知道这些文件的用处,我们认为他们对PCB生产没有影响.
建议:
Wewillignoreit.我们将忽略他们.
(23)问题:
Wedon'thavethestandardofthe"BSEN0249-2-12:
1994"inhand.
我们没有"BSEN0249-2-12:
1994"的标准控制.
建议:
WewillignorethisstandardandfollowIPC-4101Bstandardtoproduce.
我们将忽略这个标准,然后按IPC-4101B标准来生产.
(24)问题:
Inthefuture,forthesameseries,ifwemeetthesamequestionslikeasabove,wewillusetheanswerdirectly
后续问题中,如有类似以上问题,我们将直接使用这次的回复来生产.
2文字
(1)问题:
Somefontsareclosetopads,intoholesoroutsideoftheboardoutline.
一些文字太靠近pad,进孔或到了板外.
建议:
Wewillmovethemifpossible,otherwisewe'llclipthem,pleaseconfirm.
如果可能,我们将文字移动,否则我们会修剪文字,请确认.
(2)问题:
WewilladdtheUL,includingourlogoanddatecode(WWYY)atfreeareaonthetopsilkscreenlayer.我们将在顶层文字的空旷位置添加UL,包括我们的标记和周期.
(3)问题:
Inordertoidentifytheboardeasily,wewouldliketoaddourinternalpartnumberonthebreakawayrails.(ornearourcompanyUL)为了更好地区分板子,我们想要在工艺边上添加我司料号.(或在我司UL附近)
(4)问题:
Weturnthelogoto"BLDTD-B"onthebottomsilkscreenornot?
Pleaseconfirm.请确认我们可否将底层文字的UL改为"BLDTD-B"?
(5)问题:
YourequesttoaddULanddatecode(WWYY)ontheappointedposition,butthedrawingwithoutappointedposition。
WewilladdourcompanyULanddatecode(WWYY)onbottomsilkscreenlayerasbelowfig.
贵司要求在指定位置添加UL和周期(WWYY),但图纸上没有标出指定的位置.我们将在底层文字添加我司UL和周期(WWYY),见下图.
(6)问题:
SomeWhiteoilblockareprintedonthepads,itwillaffectthesolderabilityofthepads.一些白油块在pad上,这会影响pad的焊接性能.
建议:
Wewillmodifythelegendtoavoidthemexposingonthepads.
我们将修剪文字来避免他们上pad.
(7)问题:
Somefontsaretooclosetotheoutline,itmaycausethefontstobeincompleteaftermanufacturing.
一些文字太靠近外形线,这可能会导致加工后文字出现残缺.
建议:
Reducethefontsizetoaccommodatethetightspaceifpossible,otherwiseaccepttheincompletefonts.
如果可能的话,缩小文字到一个小空间,否则就接受文字残缺.
(8)问题:
TthereisnoenoughspaceforaddingtheULanddatecodeonthetopsilkscreenlayer顶层文字不够空间添加UL.和周期
建议:
A:
Wewilladdthemonthebottomsilkscreenlayer.
B:
Wewilladdthemonthetopsoldermasklayer.
A:
在底层文字添加
B:
在顶层防焊添加
(9)问题:
Somelegendarenotmirroredonthebottomsides.
在底层中,有一些文字没有镜像.
建议:
A:
wewillfollowgebertoproduceandacceptthelegendareinverse.
B:
wewillmirrorit.
A:
我们将依gerber生产,要接受反字.
B:
我们将镜像制作.
(10)问题:
Thelegendisveryclosetodummycopperpadsintheworkinggerber.
在工作稿中的文字太靠近焊盘.
建议:
A:
Wewillshavethedummycopperpadstoavoidtheillegiblelegend.
B:
Followworkinggerbertobuild,andtheillegiblelegendisacceptable
A:
我们将削铜粒来避免文字模糊.
B:
依工作稿制作,接受文字模糊.
(11)问题:
Inordertoavoidthesilkscreenismissing,wewilladdthecheckpatternsonthebreakawayrail.为了防止漏印文字,我们将在工艺边添加测试图案.
3防焊
(1)问题:
SpacingbetweenICpadsare6.7miland7.5mil.Weneed7.8miltokeepthesoldermaskdam..Becausethesoldermaskinkarebluecolorwhichisoutofourcapabilitytobuildthebluesoldermaskdam.
IC之间的距离是6.7和7.5mil,我们需要7.8mil的距离来做防焊桥.因为防焊颜色为蓝色,这样距离的蓝油桥超出我们的制程.
建议:
WesuggestcancelingthesoldermaskdamwheretheICspacingislessthan7.8milandmakegangrelief.Pleaseconfirmisthatacceptable.
我们建议在小于7.8mil的地方取消做防焊桥,然后按开通窗制作.请确认是否接受.
(2)问题:
SpacingbetweentheBGAPADandviaholeisonly9.8mil,andthere'ssoldermaskdam.Thespacingistoosmalltokeepdam.
BGA到过孔的距离只有9.8mil,而且要做防焊桥.这个距离太小,不能做桥.
建议:
Wewillremovethevia's(nottheBGApads)openings我们将移除过孔的开窗(不是BGA的开窗).
(3)问题:
The∮29milcomponentholeswithoutsoldermaskopeningsonbottomsides,thesoldermaskinkwillflowintoholes
∮29mil的元件孔在底面没有开窗,油墨会进孔.
建议:
A)Weaddsoldermaskopeningsforhole,MakesuretheoilisnotonthePADandnotflowintothehole.
B)WefollowtheGERBERtodo,Pleaseconfirmthesoldermaskinkwillflowintoholesareaccepted.
A:
我们将为这些孔添加防焊开窗,确保油墨不上pad和油墨不进孔.
B:
我们根据gerber制作,请确认可接受油墨进孔.
(4)问题:
Seebelowfigure,thereisonepadonthebottompastelayer,butitwithoutsoldermaskopeningonthebottomsolderlayer.见下图.贴片层上有一个pad没有开窗.
建议:
A:
followthegerber.
B:
Addsoldermaskopeningthatis8milbiggerthanthepad.
A:
依gerber制作.
B:
加一个比pad大8mil的开窗.
(5)问题:
TheΦ1.0mmholeswithsoldermaskopeningonthetopsoldermasklayer,butthebottomlayer.Pleasecomfirmoursuggestion
Φ1.0mm的孔在顶层有开窗,但底层没开窗。
请确认我们的建议.
建议:
A:
Followthegerbertoprocess.按gerber生产.
B:
Addthesoldermaskopeningfortheholesonthebottomlayer,thesizeisthesameasthetop.在底层添加开窗,大小跟顶层一样.
(6)问题:
Thesoldermaskopeningofdia.0.40mmholesisonly8milbiggerthantheviaholes.
直径0.40mm的孔防焊开窗只比过孔大8mil.
建议:
A:
Cancelthesoldermaskopeningofviaholes,theviaholespluggedwithsoldermaskisaccepted.取消过孔的防焊开窗,接受过孔塞油.
B:
followthegerber,andacceptsoldermaskintotheholebutnoplugging
依gerber制作,接受油墨入孔,但不塞孔..
(7)问题:
Thetwodia.3.2mmholesarespecifiedasPTHindrillchart.Butthesoldermaskopeningislessthanthepadsonbottomsoldermasklayers.
分孔表上直径3.2mm的孔是制作为PTH,但在底层防焊层里,开窗比pad小.
建议:
Wewillfollowgerbertoproduce,andallowthesoldermaskencroachontothesepads.我们将根据GERBER生产,然后接受油墨上pad.
(8)问题:
Somesoldermaskopeningforthefiducialmarkistoobigthatitcausednearboringtraceexposedintheworkinggerber.
一些光学点的开窗太大,导致工作稿中他们邻近的导线露铜.
建议:
Wewilltrimthesoldermaskopeningtoavoidthetraceexposed.
我们将修改防焊开窗来避免铜线外露.
(9)问题:
ThereisnosoldermaskopeningononesidefortheviaholeΦ16mil.
Φ16mil的孔有一面防焊没开窗.
建议:
A:
Plugtheseviaholeswithsoldermaskink.
B:
AddsoldermaskopeningbothsidesfortheviaholeΦ16mil.
A:
塞孔制作.
B:
Φ16mil的孔双面开窗.
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