HDI印刷线路板流程介绍.pptx

HDI印刷线路板流程介绍.pptx

《HDI印刷线路板流程介绍.pptx》由会员分享，可在线阅读，更多相关《HDI印刷线路板流程介绍.pptx（50页珍藏版）》请在冰点文库上搜索。

WWEICONFIDENTIALWWEICONFIDENTIALWWEICONFIDENTIALHDI印刷電路板流程介紹1HDIManufacturingProcessFlowWWEICONFIDENTIALWWEICONFIDENTIALWWEICONFIDENTIALHDI印刷電路板流程介紹2Pre-engineeringPatternimagingEtchingLaminatingDrillingCuplatingHolepluggingPatternimagingLaminationLaserAblationMechanicaldrillingPatternimagingCuplatingSolderMaskSurfaceFinishedRoutingVisualinspectionElectrictestShippingWWEICONFIDENTIALWWEICONFIDENTIALWWEICONFIDENTIALHDI印刷電路板流程介紹3Pre-engineeringPatternimagingEtchingLaminatingDrillingWWEICONFIDENTIALWWEICONFIDENTIALWWEICONFIDENTIALHDI印刷電路板流程介紹4DesmearCuplatingHolepluggingCuplatingBeltSandingWWEICONFIDENTIALWWEICONFIDENTIALWWEICONFIDENTIALHDI印刷電路板流程介紹5LaminationLaserAblationMechanicaldrillingCuplatingPatternimagingWWEICONFIDENTIALWWEICONFIDENTIALWWEICONFIDENTIALHDI印刷電路板流程介紹6SolderMaskGoldplatingRoutingElectricaltestPatternimagingWWEICONFIDENTIALWWEICONFIDENTIALWWEICONFIDENTIALHDI印刷電路板流程介紹7HolecounterShippingVisualinspectionWWEICONFIDENTIALWWEICONFIDENTIALWWEICONFIDENTIALHDI印刷電路板流程介紹8*Rawmaterial（ThinCore,Copper,Prepreg.）RawMaterial:

FR-4（Difuntional,Tetrafuntional）RawMaterial:

FR-4（Difuntional,Tetrafuntional）Supplier:

EMC,Nan-YaSupplier:

EMC,Nan-YaSheetsize:

36”*48”,40”*48”,42”*48Sheetsize:

36”*48”,40”*48”,42”*48CoreThickness:

0.003”,0.004”,0.005”,0.006”CoreThickness:

0.003”,0.004”,0.005”,0.006”0.008”,0.010”,0.012”,0.015”0.008”,0.010”,0.012”,0.015”0.021”,0.031”,0.039”,0.047”0.021”,0.031”,0.039”,0.047”CopperFoil:

1/3oz,1/2oz,1.0oz,2ozCopperFoil:

1/3oz,1/2oz,1.0oz,2ozPrepregtype:

1080,2113,2116,1506,7628,7630Prepregtype:

1080,2113,2116,1506,7628,7630WWEICONFIDENTIALWWEICONFIDENTIALWWEICONFIDENTIALHDI印刷電路板流程介紹91.內層基板（THINCORE）LaminateCopperFoil裁板（PanelSize）COPPERFOILCOPPERFOILEpoxyGlassEpoxyGlassWWEICONFIDENTIALWWEICONFIDENTIALWWEICONFIDENTIALHDI印刷電路板流程介紹10PhotoResistPhotoResist2.內層線路製作（壓膜）（DryFilmResistCoat）EtchPhotoresist（D/F）WWEICONFIDENTIALWWEICONFIDENTIALWWEICONFIDENTIALHDI印刷電路板流程介紹11PhotoResistPhotoResist3.內層線路製作（曝光）（Expose）A/WArtworkArtwork（底片底片）ArtworkArtwork（底片底片）AfterExposeBeforeExposeWWEICONFIDENTIALWWEICONFIDENTIALWWEICONFIDENTIALHDI印刷電路板流程介紹124.內層線路製作（顯影）（Develop）PhotoResistPhotoResistWWEICONFIDENTIALWWEICONFIDENTIALWWEICONFIDENTIALHDI印刷電路板流程介紹135.內層線路製作（蝕刻）（Etch）PhotoResistPhotoResistWWEICONFIDENTIALWWEICONFIDENTIALWWEICONFIDENTIALHDI印刷電路板流程介紹146.內層線路製作（去膜）（StripResist）WWEICONFIDENTIALWWEICONFIDENTIALWWEICONFIDENTIALHDI印刷電路板流程介紹157.黑氧化（OxideCoating）WWEICONFIDENTIALWWEICONFIDENTIALWWEICONFIDENTIALHDI印刷電路板流程介紹168.疊板（Lay-up）LAYER2LAYER3LAYER4LAYER5LAYER1LAYER6Layer1Layer2Layer3Layer4CopperFoilCopperFoilInnerLayerPrepreg（膠片）Prepreg（膠片）WWEICONFIDENTIALWWEICONFIDENTIALWWEICONFIDENTIALHDI印刷電路板流程介紹179.壓合（Lamination）WWEICONFIDENTIALWWEICONFIDENTIALWWEICONFIDENTIALHDI印刷電路板流程介紹18典型之多層板疊板及壓合結構典型之多層板疊板及壓合結構.COPPERFOIL0.5OZThinCore,FR-4prepregCOMPS0LD.prepregThinCore,FR-4prepregCOPPERFOIL0.5OZ疊合用之鋼板疊合用之鋼板10-1210-12層疊合層疊合壓合機之熱板壓合機之熱板COPPERFOIL0.5OZThinCore,FR-4prepregCOMPS0LD.prepregThinCore,FR-4prepregCOPPERFOIL0.5OZ疊合用之鋼板疊合用之鋼板WWEICONFIDENTIALWWEICONFIDENTIALWWEICONFIDENTIALHDI印刷電路板流程介紹19墊木板板鋁10.鑽孔（Drilling）WWEICONFIDENTIALWWEICONFIDENTIALWWEICONFIDENTIALHDI印刷電路板流程介紹2011.電鍍Desmear&CopperDepositionWWEICONFIDENTIALWWEICONFIDENTIALWWEICONFIDENTIALHDI印刷電路板流程介紹2112.塞孔（HolePlugging）13.去溢膠（BeltSanding）WWEICONFIDENTIALWWEICONFIDENTIALWWEICONFIDENTIALHDI印刷電路板流程介紹2214.減銅（CopperReduction）Option15.去溢膠（BeltSanding）OptionWWEICONFIDENTIALWWEICONFIDENTIALWWEICONFIDENTIALHDI印刷電路板流程介紹2316.外層壓膜DryFilmLamination（Outerlayer）PhotoResistWWEICONFIDENTIALWWEICONFIDENTIALWWEICONFIDENTIALHDI印刷電路板流程介紹2417.外層曝光ExposeUV光源WWEICONFIDENTIALWWEICONFIDENTIALWWEICONFIDENTIALHDI印刷電路板流程介紹2518.AfterExposedWWEICONFIDENTIALWWEICONFIDENTIALWWEICONFIDENTIALHDI印刷電路板流程介紹2619.外層顯影DevelopWWEICONFIDENTIALWWEICONFIDENTIALWWEICONFIDENTIALHDI印刷電路板流程介紹2720.蝕刻EtchWWEICONFIDENTIALWWEICONFIDENTIALWWEICONFIDENTIALHDI印刷電路板流程介紹2820.去乾膜StripResistWWEICONFIDENTIALWWEICONFIDENTIALWWEICONFIDENTIALHDI印刷電路板流程介紹2921.壓合（Build-upLayerLamination）RCCRCC（ResinCoatedCopperfoil）（ResinCoatedCopperfoil）WWEICONFIDENTIALWWEICONFIDENTIALWWEICONFIDENTIALHDI印刷電路板流程介紹3021.護形層製作（壓膜）（ConformalMask）DryFilmDryFilm（乾膜乾膜）DryFilmDryFilm（乾膜乾膜）WWEICONFIDENTIALWWEICONFIDENTIALWWEICONFIDENTIALHDI印刷電路板流程介紹31ArtworkArtwork（底片底片）ArtworkArtwork（底片底片）22.護形層製作（曝光）（ConformalMask）BeforeExposureAfterExposureWWEICONFIDENTIALWWEICONFIDENTIALWWEICONFIDENTIALHDI印刷電路板流程介紹3223.護形層製作（顯像）（ConformalMask）WWEICONFIDENTIALWWEICONFIDENTIALWWEICONFIDENTIALHDI印刷電路板流程介紹3324.護形層製作（蝕銅）（ConformalMask）WWEICONFIDENTIALWWEICONFIDENTIALWWEICONFIDENTIALHDI印刷電路板流程介紹3425.護形層製作（去膜）（ConformalMask）WWEICONFIDENTIALWWEICONFIDENTIALWWEICONFIDENTIALHDI印刷電路板流程介紹3526.雷射鑽孔（LaserAblation）及機械鑽孔WWEICONFIDENTIALWWEICONFIDENTIALWWEICONFIDENTIALHDI印刷電路板流程介紹36MechanicalDrill（P.T.H.）LaserMicrovia（BlindVia）27.機械鑽孔（MechanicalDrill）WWEICONFIDENTIALWWEICONFIDENTIALWWEICONFIDENTIALHDI印刷電路板流程介紹3728.電鍍（Desmear&CopperDeposition）WWEICONFIDENTIALWWEICONFIDENTIALWWEICONFIDENTIALHDI印刷電路板流程介紹3829.外層線路製作（Patternimaging）壓膜（D/FLamination）WWEICONFIDENTIALWWEICONFIDENTIALWWEICONFIDENTIALHDI印刷電路板流程介紹39曝光（Exposure）顯像（D/FDeveloping）WWEICONFIDENTIALWWEICONFIDENTIALWWEICONFIDENTIALHDI印刷電路板流程介紹40蝕銅（Etching）去膜（D/FStripping）WWEICONFIDENTIALWWEICONFIDENTIALWWEICONFIDENTIALHDI印刷電路板流程介紹4130.防焊（綠漆）製作（SolderMask）WWEICONFIDENTIALWWEICONFIDENTIALWWEICONFIDENTIALHDI印刷電路板流程介紹42WWEI94V-0R10531.S/M顯像（S/MDeveloping）32.印文字（LegendPrinting）WWEICONFIDENTIALWWEICONFIDENTIALWWEICONFIDENTIALHDI印刷電路板流程介紹4333.浸金（噴錫）製作（ElectrolessNi/Au,HAL）WWEI94V-0R105WWEICONFIDENTIALWWEICONFIDENTIALWWEICONFIDENTIALHDI印刷電路板流程介紹44WWEI94V-0R105DedicateoruniversalTesterDedicateoruniversalTesterFlyingProbeTesterFlyingProbeTester34.成型（Profile）35.測試（ElectricalTesting）WWEICONFIDENTIALWWEICONFIDENTIALWWEICONFIDENTIALHDI印刷電路板流程介紹45WWEI94V-0R105WWEI94V-0R10536.終檢（FinalInspection）37.O.S.P.（entekplusCu_106A.）OptionWWEICONFIDENTIALWWEICONFIDENTIALWWEICONFIDENTIALHDI印刷電路板流程介紹46LASERBLIND&BURIEDVIALAY-UPA=THROUGHVIAHOLE（導通孔）B=BURIEDVIAHOLE（埋孔）C=OneLevelLaserBlindVia（雷射盲孔）LASERBLIND&BURIEDVIALAY-UPBURIEDVIAANDLASERBLINDVIAOPTION（雷射盲埋孔之選擇）DCCD=TwoLevelLaserVia（雷射盲孔）CDCB-STAGEB-STAGEFR-4CoreRCCFR-4CoreB-STAGEB-STAGERCCABBAWWEICONFIDENTIALWWEICONFIDENTIALWWEICONFIDENTIALHDI印刷電路板流程介紹47BURIEDVIALAY-UPA=THROUGHVIAHOLE（導通孔）B=BURIEDVIAHOLE（埋孔）C=BLINDVIAHOLE（盲孔）D=BLINDHOLEMLBVIA（多層盲孔）BLINDVIALAY-UPBLINDVIASEQUENTIALLAY-UPABBARESINB-STAGEBLINDANDBURIEDVIAOPTION（盲埋孔之選擇）DACCE=VIAINPAD（VIP）（導通孔在pad裡面）EWWEICONFIDENTIALWWEICONFIDENTIALWWEICONFIDENTIALHDI印刷電路板流程介紹48ConventionalPCBFR-4Build-upLayerBuild-upLayerPhoto-viaPhoto-ImageableDielectric（PID）FR-4ConventionalPTHConventionalPTHWWEICONFIDENTIALWWEICONFIDENTIALWWEICONFIDENTIALHDI印刷電路板流程介紹49ConventionalPCBBlindViaPCBPTH3millineSVHIVHChip-on-SVHFR-4ConventionalPTHConventionalPTHWWEICONFIDENTIALWWEICONFIDENTIALWWEICONFIDENTIALHDI印刷電路板流程介紹50Q&AQ&AENDEND