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wire bonding in microelectronics, 3e.pdf

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WireBondinginMicroelectronicsAbouttheAuthorGeorgeG.HarmanisaretiredFellowoftheNationalInstituteofStandardsandTechnology（NIST）.HehasaBSinindustrialphysicsfromVirginiaPolytechnicInstitute&StateUniversityandanMSinphysicsfromtheUniversityofMaryland（1959）.HarmanisaformerPresidentofIMAPS（19951996）andChairoftheIEEECPMTFellowCommittee（19882002）.HeisalifefellowofbothIMAPSandoftheIEEE.Hehasheldmanyotherelectedandappointedpositionsinthosesocieties,andisamemberoftheITRSRoadmapCommitteeforAssemblyandPackaging（formorethan10years）.Heiswidelyconsideredtobetheworldsforemostauthorityonwirebonding.Harmanhaspublishedmorethan60papers,3booksonwirebonding（the3editionsofWireBondinginMicroelectronics）,8bookchapters,4patents,andhasgivenabout100,8-hour,shortcoursesonwirebondingaroundtheworld（overthepast30years）.Hehasreceivednumerousawards,bothdomesticallyandinternationally.HismostrecentweretheIMAPS“LifetimeAchievementAward”（2006）andtheIEEE“FieldAwardforComponents,Packaging,andManufacturingTechnology”（2009）.WireBondinginMicroelectronicsGeorgeHarmanThirdEditionNewYorkChicagoSanFranciscoLisbonLondonMadridMexicoCityMilanNewDelhiSanJuanSeoulSingaporeSydneyTorontoCopyright2010,1997,1989byTheMcGraw-HillCompanies,Inc.Allrightsreserved.ExceptaspermittedundertheUnitedStatesCopyrightActof1976,nopartofthispublicationmaybereproducedordistributedinanyformorbyanymeans,orstoredinadatabaseorretrievalsystem,withoutthepriorwrittenpermissionofthepublisher.ISBN:

978-0-07-164265-1MHID:

0-07-164265-XThematerialinthiseBookalsoappearsintheprintversionofthistitle:

ISBN:

978-0-07-147623-2,MHID:

0-07-147623-7.Alltrademarksaretrademarksoftheirrespectiveowners.Ratherthanputatrademarksymbolaftereveryoccurrenceofatrademarkedname,weusenamesinaneditorialfashiononly,andtothebenefitofthetrademarkowner,withnointentionofinfringementofthetrademark.Wheresuchdesignationsappearinthisbook,theyhavebeenprintedwithinitialcaps.McGraw-HilleBooksareavailableatspecialquantitydiscountstouseaspremiumsandsalespromo-tions,orforuseincorporatetrainingprograms.Tocontactarepresentativepleasee-mailusatbulksalesmcgraw-.InformationcontainedinthisworkhasbeenobtainedbyTheMcGraw-HillCompanies,Inc.（“McGraw-Hill”）fromsourcesbelievedtobereliable.However,neitherMcGraw-Hillnoritsauthorsguaranteetheaccuracyorcompletenessofanyinformationpublishedherein,andneitherMcGraw-Hillnoritsauthorsshallberesponsibleforanyerrors,omissions,ordamagesarisingoutofuseofthisinformation.ThisworkispublishedwiththeunderstandingthatMcGraw-Hillanditsauthorsaresupplyinginformationbutarenotattemptingtorenderengineeringorotherprofessionalservices.Ifsuchservicesarerequired,theassistanceofanappropriateprofessionalshouldbesought.TERMSOFUSEThisisacopyrightedworkandTheMcGraw-HillCompanies,Inc.（“McGraw-Hill”）anditslicensorsreserveallrightsinandtothework.Useofthisworkissubjecttotheseterms.ExceptaspermittedundertheCopyrightActof1976andtherighttostoreandretrieveonecopyofthework,youmaynotdecompile,disassemble,reverseengineer,reproduce,modify,createderivativeworksbasedupon,transmit,distribute,disseminate,sell,publishorsublicensetheworkoranypartofitwithoutMcGraw-Hillspriorconsent.Youmayusetheworkforyourownnoncommercialandpersonaluse;anyotheruseoftheworkisstrictlyprohibited.Yourrighttousetheworkmaybeterminatedifyoufailtocomplywiththeseterms.THEWORKISPROVIDED“ASIS.”McGRAW-HILLANDITSLICENSORSMAKENOGUAR-ANTEESORWARRANTIESASTOTHEACCURACY,ADEQUACYORCOMPLETENESSOFORRESULTSTOBEOBTAINEDFROMUSINGTHEWORK,INCLUDINGANYINFORMATIONTHATCANBEACCESSEDTHROUGHTHEWORKVIAHYPERLINKOROTHERWISE,ANDEXPRESSLYDISCLAIMANYWARRANTY,EXPRESSORIMPLIED,INCLUDINGBUTNOTLIMITEDTOIMPLIEDWARRANTIESOFMERCHANTABILITYORFITNESSFORAPARTIC-ULARPURPOSE.McGraw-Hillanditslicensorsdonotwarrantorguaranteethatthefunctionscontainedintheworkwillmeetyourrequirementsorthatitsoperationwillbeuninterruptedorerrorfree.NeitherMcGraw-Hillnoritslicensorsshallbeliabletoyouoranyoneelseforanyinaccuracy,errororomission,regardlessofcause,intheworkorforanydamagesresultingtherefrom.McGraw-Hillhasnoresponsibilityforthecontentofanyinformationaccessedthroughthework.UndernocircumstancesshallMcGraw-Hilland/oritslicensorsbeliableforanyindirect,incidental,special,punitive,consequentialorsimilardamagesthatresultfromtheuseoforinabilitytousethework,evenifanyofthemhasbeenadvisedofthepossibilityofsuchdamages.Thislimitationofliabilityshallapplytoanyclaimorcausewhatsoeverwhethersuchclaimorcausearisesincontract,tortorotherwise.Disclaimer:

ThiseBookdoesnotincludetheancillarymediathatwaspackagedwiththeoriginalprintedversionofthebook.ContentsIntroductiontoThirdEdition.xvAcknowledgments.xviiiIntroductiontoCD.xix1TheTechnicalIntroductiontotheThirdEdition.11.1TheWedge-andBall-BondingMachineOperations.21.2HowtoApproachBondingProblems?

.61.2.1WhichMetalsCanBeUltrasonicallyBonded?

.61.2.2AssessingtheBondabilityandReliabilityofProposedNewBondSystems.81.2.3SomeUnusualUsesofWireBonds.10References.112UltrasonicBondingSystemsandTechnologies,IncludingaDescriptionoftheUltrasonicWireBondingMechanism.132.1Introduction.132.2UltrasonicTransducerandToolVibrationModes.142.3HowUltrasonicBondsAreMade（EmpiricalDescription）.222.3.1.BriefPhenomenologicalExplanationoftheUltrasonicandThermosonicBondingProcess.242.4BondingwithHigh（er）FrequencyUltrasonicEnergy.302.5In-Process（Real-Time）BondMonitoring.322.6Wire-BondingTechnologies.332.6.1ThermocompressionBonding.332.6.2UltrasonicWedgeBonding（Small-andLarge-DiameterWires）.342.6.3ThermosonicBallandWedgeBonding.362.6.4ChoosingaNew/DifferentWire-BondingTechnology.36vviContents2.7VariationsofFine-WireBondingTechnology.382.7.1RibbonWireBonding.382.7.2ParallelGapandTweezerWelding.392.8MajorChipInterconnectionAlternativestoWireBonding（FlipChipandTAB）.422.8.1FlipChip.422.8.2Tape-AutomatedBonding.442.9Wire-BondingTechnology:

AComparisonandFutureDirections.45References.463BondingWireMetallurgyandCharacteristicsThatCanAffectBonding,Reliability,orTesting.513.1Introduction.513.2Stress-StrainCharacteristicsofBondingWires.523.3TheShelf-LifeAgingofBondingWires.533.4GeneralDiscussionofGoldBondingWire.583.5AluminumWireforUltrasonicWedgeBonding.613.6WireandMetallizationHardness.623.7TheEffectofEFOPolarityonGoldWireandItsMetallurgy.633.8MetallurgicalFatigueofBondingWires.633.9CopperWireforBallBonding.673.10ConductorBurnOut（Fusing）.683.10.1BondingWires.683.10.2TheMaximumAllowableCurrentforPCBandMCMConductors.72Appendix3A.73Appendix3B.74Conclusion.76References.764WireBondTesting.794.1Introduction.794.2TheDestructiveBondPullTest.804.2.1VariablesoftheBondPullTest.804.2.2Peeling（TweezerPulling）for“QualityTests”andTroubleshootingofWedgeBondsandCrescent（Tail）Bonds.834.2.3FailurePredictionsThatAreBasedonPullTestDataMustHaveConfirmedNormality.854.2.4EffectofMetallurgyandBondingProcessesontheBondPullForce.864.2.5EffectofWireElongationonBondPullForce（PrimarilyforLarge-DiameterAl,butalsoforAuWireUsedinBallBonding）4-9.884.3Ball-BondShearTest.924.3.1Introduction.924.3.2Apparatus.934.3.3AManualShearProbeAsanAidinSettingUpBallBonder（ForLaboratoryUse）.954.3.4InterferencestoMakingAccurateBall-ShearTestMeasurements.974.3.5Ball-ShearForceversusBondedArea.1014.3.6EffectofGold-AluminumIntermetallicsontheShearForce.1074.3.7PluckTest,PryTest,FlipTest,etc.（FailureAnalysisTechnique）.1074.3.8ComparisonoftheBall-ShearandtheBond-PullTests.1094.3.9ApplicationsoftheBall-ShearTest.1094.3.10ShearTestforWedgeBonds.1124.3.11Ball-ShearTestStandardization.1154.4EvaluatingBoththeBallandtheWedgeBondonaSingleWire.1164.5ThermalStressTestforAu-AlWireBondReliability.1164.6FutureIssuesinWireBondTesting.117Appendix4ATypicalFailureModesoftheBall-ShearTest（FailureMode2IstheNormalDesiredTestResult）.118Appendix4BTheNondestructiveBondPullTest.1204B.1Introduction.1204B.2MetallurgicalandStatisticalInterpretationoftheNDPTest.1214B.3AssessmentofAnyNDPTest-InducedMetallurgicalDefects.1234B.4LimitationsoftheNDPTest.124ContentsviiviiiContents4B.5TheCurrentStatusoftheNDPT（2008）forCriticalSpaceApplications.125References.1265Gold-AluminumIntermetallicCompoundsandOtherMetallicInterfaceReactionsinWireBonding.1315.1Gold-AluminumIntermetallicCompoundFormationandClassicalWire-BondFailures.1315.1.1Introduction.1315.1.2IntermetallicCompoundFormationintheAu-AlSystem.1325.1.3TheClassicalAu-AlCompoundFailureModes.1395.1.4ReversingtheAu-AlMetallurgicalInterfaces.1445.1.5TheEffectofDiffusionInhibitorsandBarriers.1465.2Impurity-AcceleratedAu-AlBondFailures.1485.2.1TheEffectofHalogensontheAu-AlBondSystem.1485.2.2RecommendationsforRemovingorAvoidingHalogenContamination.1515.2.3NonhalogenEpoxyOutgassingInducedBondFailures.1535.2.4GreenMoldCompoundProblems.1535.3Nongold-AluminumBondInterfaces.1545.3.1Aluminum-CopperWire-BondSystem.1545.3.2AluminumBondPadsContainingCopper,CausingBondingProblems.1565.3.3Copper-GoldWir