整理聚酰亚胺薄膜和尺寸稳定及其制备工艺Word文件下载.docx

整理聚酰亚胺薄膜和尺寸稳定及其制备工艺Word文件下载.docx

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环境影响经济损益分析一般按以下四个步骤进行：

本章中环境影响评价制度，2010年的真题中全部集中在环境影响评价这一节。

环境保护的对象，环境影响评价制度，环境影响评价文件的组成、文件的报批等是历年考试的热点。

Inventors:

1.环境的概念Kumagawa;

Kiyoshi（Ube,JP）,Kuniyasu;

Kenji（Ube,JP）,Nishino;

Toshiyuki（Ube,JP）,Matsui;

Yuji（Ube,JP）

Assignee:

（二）环境保护法律法规体系UbeIndustries,Ltd.（Yamaguchi,JP）

（2）环境影响后评价。

Appl.No.:

06/864,299

1.规划环境影响评价的报审Filed:

May16,1986

新增加的六个内容是：

风险评价；

公众参与；

总量控制；

清洁生产和循环经济；

水土保持；

社会环境影响评价。

（2）评价范围。

根据评价机构专业特长和工作能力，确定其相应的评价范围。

ForeignApplicationPriorityData

May17,1985[JP]

60-103674

60-103675

CurrentU.S.Class:

428/220;

428/473.5;

428/901;

528/353

CurrentInternationalClass:

C08J5/18 

（20060101）;

B32B027/28 

（）;

B32B027/34 

C08G069/26 

（）

FieldofSearch:

428/473.5,220,901528/353264/212

ReferencesCited[ReferencedBy]

ForeignPatentDocuments

007805

Jan.,1980

JP

0007805

PrimaryExaminer:

Herbert;

ThomasJ.

Attorney,AgentorFirm:

Burgess,Ryan&

Wayne

Claims

Weclaim:

1.Adimensionallystablepolyimidefilmcomposedofanaromaticpolyimideobtainedfromasolutionofapolymerformedbypolymerizationofabiphenyl-tetracarboxylicacidandaphenylenediamine,whereintheaveragelinearexpansioncoefficientofthepolyimidefilminthetemperaturerangeoffrom50.degree.C.to300.degree.C.is0.1.times.10.sup.-5to2.5.times.10.sup.-3cm/cm..degree.C.,theratio（MD/TD）ofthelinearexpansioncoefficientinthemachinedirection（MDdirection）ofthefilmtothelinearexpansioncoefficientinthetransversedirection（TDdirection）ofthefilmisintherangeoffrom1/5to4,andthethermaldimensionstabilityexpressedbytheratioofthechangeofthesizeofthefilmatnormaltemperatureaftertheheattreatmentwherethetemperatureiselevatedto400.degree.C.fromnormaltemperatureandthefilmismaintainedat400.degree.C.for2hoursislessthar0.3%.

2.Apolyimidefilmassetforthinclaim1,whichisflexibleandhasathicknessof1to150.mu.m.

3.Apolyimidefilmassetforthinclaim1,whereintheaveragelinearexpansioncoefficientis0.5.times.10.sup.-5to2.3.times.10.sup.-5cm/cm..degree.C.

4.Apolyimidefilmassetforthinclaim1,whereintheMD/TDratioisfrom1/3to3.0.

5.Apolyimidefilmassetforthinclaim1,whereinthethermaldimensionstabilityislessthan0.25%.

6.Apolyimidefilmassetforthinclaim1,whichiscomposedofahigh-molecular-weightaromaticpolyimidecomprisingatleast90mole%ofrecurringunitsrepresentedbythefollowinggeneralformula（I）:

##STR3##

7.Apolyimidefilmassetforthinclaim6,whereinthehigh-molecular-weightaromaticpolyimidecomprisesatleast95mole%ofsaidrecurringunits.

8.Apolyimidefilmassetforthinclaim1,whereinthecontentofvolatilecomponentsislowerthan1%byweight.

9.Apolyimidefilmassetforthinclaim8,whereinthecontentofvolatilecomponentsislowerthan0.5%byweight.

Description

BACKGROUNDOFTHEINVENTION

1.FieldoftheInvention

Thepresentinventionrelatestoaprocessforpreparinganaromaticpolyimidefilmhavingexcellentthermaldimensionstabilityfromasolutionofapolyimideprecursor（forexample,anaromaticpolyamicacid）obtainedfromabiphenyl-tetracarboxylicacidandaphenylenediaminebyasolutioncastingmethodorthelike.Moreparticularly,thepresentinventionrelatestoathermallystablearomaticpolyimidefilmhavingahighthermaldimensionstability（oralowthermalsizechange）andanaveragelinearexpansioncoefficientwhichissubstantiallyequaltothelinearexpansioncoefficientofaceramicormetal,andaprocessforthepreparationthereof.

Thispolyimidefilmisveryvaluableasabasefilmofaprintedcircuitboardordinarilyusedforanelectricorelectronicpart.

2.DescriptionoftheRelatedArt

Anaromaticpolyimidefilmobtainedfrompyromelliticdianhydrideandanaromaticdiamineisusedasatypicalinstanceofthearomaticpolyimidefilm.Sincetheaveragelinearexpansioncoefficientofthispolyimidefilmintheunorientedstateisaslargeasabout3.5.times.10.sup.-5toabout4.5.times.10.sup.-5cm/cm..degree.C.,whenthefilmisbondedtoacopperfoilorthelikeatahightemperature,alargeamountofcurlingoccurs.

Asmeansforsolvingthisproblem,GB-A-No.1098556proposesamethodinwhichthedrawingoperationiscarriedoutatthefilm-formingsteptoreducetheaveragelinearexpansioncoefficientofthefilm.However,thefilmobtainedaccordingtothismethodisdefectiveinthattheratioofthechangeofthesizeatnormaltemperatureaftertheheattreatmentwherethetemperatureiselevatedtoabout400.degree.C.fromnormaltemperatureandthefilmismaintainedatthistemperaturefor2hours（thermaldimensionstability）isverybad,andtherefore,thefilmcannotcopewithincreaseofthewiringdensityinawiringpattern.

SUMMARYOFTHEINVENTION

Researchwasconductedwithaviewtodevelopingaprocessforpreparinganaromaticpolyimidefilmhavingsuchanaveragelinearexpansioncoefficientthatwhenthefilmisbondedtoaceramicormetal（forexample,acopperfoilorcopperalloyfoil）atahightemperature,nolargecurlingoccurs,andalsohavingagoodthermaldimensionstability.Astheresult,itwasfoundthatifathinlayerofasolutionofanaromaticpolyamicacidorthelikeobtainedbypolymerizationofabiphenyl-tetracarboxylicacidandaphenylenediamineisformedonthesurfaceofasupportandthethinlayerisdriedintwostages,thatis,onthesupportandunderalowtensioninthestateofasolidifiedfilmmemberpeeledfromthesupport,anexcellentaromaticpolyimidefilmhavingaspecificlowlinearexpansioncoefficientandahighthermaldimensionstabilitycanbeobtained.Wehavenowcompletedthepresentinventionbasedonthisfinding.

Morespecifically,inaccordancewiththepresentinvention,thereisprovidedadimensionallystablepolyimidefilmcomposedofanaromaticpolyimideobtainedfromasolutionofapolymerformedbypolymerizationofabiphenyl-tetracarboxylicacidandaphenylenediamine,whereintheaveragelinearexpansioncoefficientofthepolyimidefilminthetemperaturerangeoffrom50.degree.C.to300.degree.C.is0.1.times.10.sup.-5to2.5.times.10.sup.-5cm/cm..degree.C.,theratio（MD/TD）ofthelinearexpansioncoefficientinthemachinedirection（MDdirection）ofthefilmtothelinearexpansioncoefficientinthetransversedirection（TDdirection）ofthefilmisintherangeoffrom1/5to4,andthethermaldimensionstabilityexpressedbytheratioofthechangeofthesizeofthefilmatnormaltemperatureaftertheheattreatmentwherethetemperatureiselevatedto400.degree.C.fromnormaltemperatureandthefilmismaintainedat400.degree.C.for2hoursislessthanabout0.3%.

Furthermore,inaccordancewiththepresentinvention,thereisprovidedaprocessforthepreparationofadimensionallystablepolyimidefilm,whichcomprisespreparingasolutionofapolymerformedbypolymerizationofabiphenyl-tetracarboxylicacidandaphenylenediamineinanorganicpolarsolvent,formingathinlayerofthesolutiononthesurfaceofasupport,firstdryingthethinlayertoformasolidifiedfilmmemberinwhichthesolventandformedwaterarepresentinanamountof27to60%byweight,peelingthesolidifiedfilmmemberfromthesurfaceofthesupport,seconddryingthefilmmemberunderatensionlowerthan100g/mm.sup.2atatemperatureof80.degree.to250.degree.C.toformasolidifiedfilmwhichcontainsthesolventandformedwaterinanamountof5to25%byweight,anddryingandheat-treatingthesolidifiedfilmatatemperatureof200.degree.to500.degree.C.,whichishigherthansaidseconddryingtemperature,inthestatewhereatleastonepairofboththeoppositeedgesofthefilmarefixed,toformapolyimidefilm.

Thedimensionallystablepolyimidefilmofthepresentinventionmayalsobepreparedbyanotherprocesswhichcomprisespreparingasolutionofapolymerformedbypolymerizationofabiphenyl-tetracarboxylicacidandaphenylenediamineinanorganicpolarsolvent,formingathinlayerofthesolutiononthesurfaceofasupport,dryingthethinlayertoformasolidifiedfilminwhichthesolventandformedwaterarepresentinanamountof20to60%byweight,peelingthesolidifiedfilmfromthesurfaceofthesupport,dryingandheattreatingthesolidifiedfilmatatemperatureof200.degree.to500.degree.C.i