情绪管理方法T++EQ.docx
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情绪管理方法T++EQ
（情绪管理方法）T++EQ
TemplateofEngineeringQuery
I.Documentitems
1.Netlistfile
2.Can’topenfile
3.Missingfile
4.Whatthefilesareusedfor?
5.Rev.
6.Whichspecwillbeused?
7.Onefilm,butdifferentrequirementinanotherplace
II.Cost&specialMaterial
1.laminatematerial
2.laminatecoreforsinglesideboard
3.Soldermaskinkmaterial
4.Otherspecialmaterial
III.BoardThk&Tol
1.NospecifiedBoardThk
2.UnclearmeaningonboardThk
3.Lay-uporder
4.Lay-upstructure
IV.Drilllayer&hole
1.Holetype
2.Mismatchedholechartinformation
3.Specialholewithstrangeconductorpad
4.HoleDiameterTol
5.Pressfithole
6.Overlappedhole
7.Tooclosebetweenholetoboardedge
8.Holequantity
9.HolelocationTol
10.Positionofstamphole
V.Drawing,dimension&Tolerance
1.Outlinetolerance
2.Mismatcheddimensions
3.Missingdimensions
4.Innercornersize
5.AsymmetryTol
6.Dataofholetoedge
7.Quality&sideforFiducialmark?
8.DirectiontoarrangeunitinarrayDWG
VI.Impedanceitems
1.Whichkindofline?
2.Impedancevalue
3.Couponlinewidth
4.Distancebetweenholesincoupon
5.Testpointissue
VII.CuThk
1.PTHhole
2.Buriedhole&blindhole
3.SurfacecopperThk
VIII.Conductordesign
1.Deletenon-functionalisolatedpadsininnerlayer
2.Annularring
3.Clearanceissue
4.Isolatedlinetoseparatedifferentareaininnerlayers
5.Tentingholeissue
6.Linewidth/spacingTol
7.Strangedesign
8.Exposedcopperalongboardedge
9.PlatingGoldfingerguideline
10.Isolatedfiducialmark
11.Dummypatternatbreakawayarea
12.Dummypatternatblankareainboard
13.Fillinthenarrowspacing
14.Similarissueon“MadeinUSA”
15.LOGOposition&type
IVIII.Soldermask&Legendfilm&other（Carbonink&peelablemask）
1.SoldermaskThk
2.Pluggedholeitems
3.Soldermaskbridge
4.Exposedline/pad
5.SoldermaskbridgebetweenGoldFinger
6.DistancebetweentheS/Mopeningedgeofviahole/padandS/MopeningofthetopofGoldFinger
7.ExtraS/Mopening
8.MissingS/MopeningforSMTpad/roundpad
9.Componentmarkbridge
10.C/Mwidth
11.Reverselegend
12.LOGOincreasecost
IX.Surfacefinal
1.Nocallsurfacetreatment
2.Rohsrequirement
3.TighterThk
4.Feasibilityofprocess
XI.Fabricationforprofile
1.RoutorPunch
2.V-cut
3.G/Fbevel
4.Chamfer
XII.Bow&Twist
XIII.X-out
CommonQueryForYourReference
I.Documentitems
1.Netlistfile
Question1:
AftercomparingthecustomernetlistfilewithCADfilminputtedbyourCAD/CAM.Someshort/openwasfound.seefigxx.
Suggestion:
a）IngorethenetlistfileandjustfollowtheCADdatatodo.
b）PleaseresendtherightGerberfiletous.
2.Can’topenfile
Question2:
Wecan’topenthefileinthepackage（seefigxx）.
Suggestion:
a）Ingoreit.
b）Pleaseresendittouswithotherformat.
3.Missingfile
Question3:
MissingfilescalledintheGerberfile（seefigxx）.
Suggestion:
a）Ingorethem.
b）PleasesendthemtousASAP.
4.Whatthefilesareusedfor?
Question4:
wedon’tknowwhatthefilescalledinpackageusedfor?
（seefigxx）.
Suggestion:
a）Ingorethem.
b）Pleaseadvise.
5.Rev.
Question5:
TheRevofcustomerP/NisdifferentbetweenRevAinGerberfileandRevBinmailinformation?
（seefigxx）.
Suggestion:
a）FollowRevAinGerberfiletodo.
b）Pleaseadvise.
6.Whichspecwillbeused?
Question6:
Customerdon'tcallfabricationspecfortheproject.
Suggestion:
a）We’lluseIPC-A-600GClass2&IPC-6012Class2todo..
b）Pleaseadvise.
7.Onefilm,butdifferentrequirementinanotherplace
Question7:
Customerrequiresprintsoldermaskonbothsides,butthereisTopsidesoldermaskfilmintheGerber..
Suggestion:
a）PleaseconfirmtheoneS/Mfilmwillbeappliedtobothsides.
b）JustapplytoTopside.
II.Cost&specialMaterial
1.laminatematerial
Question1:
Customerrequirestousexxxlaminatecore,butwehavenothiskindofmaterialinstore,it’lltakelongtimetoorderthespecialmaterialandincreaseproductioncycle.
Suggestion:
Toshortenlead-time,weproposetousexxxlaminatecorefromxxxvendorinsteadofit.
Question2:
CustomerrequirestousexxxlaminatecorewithhighTg（>=170degree）,butwehavenothiskindofmaterialonhand,it’lltakelongtimetoorderthespecialmaterialandincreasehighcost.
Suggestion:
Toreducecostandshortenlead-time,weproposetousexxxlaminatecorewithnormalTg（nominal140degree）fromxxxvendorinsteadofit.
2.laminatecoreforsinglesideboard
Question3:
CustomercallFR-4materialforthesingle-sideboard.
Suggestion:
Toreducecost,weproposetouseCEM-1/CEM-3insteadofit,pleaseconfirm.
3.Soldermaskinkmaterial
Question4:
XXXsoldermaskinkisrequiredincustomerDWG,butwehavenothematerialinstock,andit’lltakelongtimetoorderitandincreasehighcost?
Suggestion:
a）Toreducecostandshortenlead-time,weproposetouseGreenxxxinkfromxxxvendorinsteadofit..
b）Pleaseadvise.
4.Otherspecialmaterial
Question5:
.Forotherspecialmaterial,refertoaboveEQtoinquirecustomertousecommoncheapmaterialinsteadofit.
III.BoardThk&Tol
1.NospecifiedBoardThk
Question1:
NotspecifiedboardThk&TolincustomerDWG&Spec..
Suggestion:
a）We’llbuildthefinishedboardThk&tolas1.6+/-0.16mm..
b）Pleaseadvise.
Question2:
Thetoleranceofboardthk+/-xxxmiliscalledincustomerDWG/Spec,butit’sverytight.Ifmeetit,wehavetoorderspecialmaterialandincreasehighcost.
Suggestion:
a）Toreducecost,pleasekindlyrelaxitto+/-10%ofboardThk.
b）Ifcustomerinsistonit,pleaseMKTreconsiderthecost.
2.UnclearmeaningonboardThk
Question3:
Wecan’tknowwhethertheboardThicknessxxxmilcalledbycustomerisfinishedorexcludingsoldermask?
.
Suggestion:
a）BoardThkXxxmilmeanstotalfinishedboardthk..
b）ItjustmeansThkbeforeplating（orsuggestexcludingsoldermask）.
3.Lay-uporder
Question4:
Customerdoesn’tdefinethelay-uporder.
Suggestion:
a）We’llbuildboardpertheorderofArt1/Art2/Art3/Art4.
b）Pleaseadvise.
4.Lay-upstructure
Question5:
Basedoncustomerlay-upstructure,finishedboardThkwillbeaaamil,butbbbmilisrequiredinDWG/spec,wecan’tmeetthematthesametime.
Suggestion:
a）Followcustomerlay-uptodo,butfinishedboardThkwillbeaaamil.
b）BuildfinishedboardThkbbbmil,butallowustoadjustlay-upasshowninattachedfigxx.
IV.Drilllayer&hole
1.Holetype
Question1:
Customerdoesn’tdefinetheholetype（PTHorNPTH）.
Suggestion:
a）We’llbuildholes’typeasoursuggestedinFigxx.
b）Pleaseadvise.
2.Mismatchedholechartinformation
Question2:
MismatchedholesizebetweenDiaxxxmilincustomerholechartandDiaxxxmilincustomerDWG（seefigxx&xx）.
Suggestion:
a）Followcustomerholecharttodo.
b）FollowdatamarkedincustomerDWGtodo.
3.Specialholewithstrangeconductorpad
Question3:
Incustomerholechart,theDiaxxxmilholeisPTHhole,butthereisnoconductorpadatthecorrespondingposition（seefigxx）
Suggestion:
a）Justfollowholechart&CADtodoitPTHwithoutannularring..
b）DoitasNPTHhole.
4.HoleDiameterTol
Question4:
Notspecifiedthetoleranceofholediameter/slotincustomerspecandDWG.
Suggestion:
a）We’llbuildthemasbelow:
ForViaholes（lessthanDia18mil）:
+3/-8mil;
ForPTH（exceptVia）:
+/-3mil;ForNPTH:
+/-2mil.
Forslotwidth+/-3mil,slotlength+/-4mil.
b）Pleaseadvise.
5.Pressfithole
Question5:
CustomerrequiresPressfitholefinishedDiaxxx+/-xxxmilanddrillbitsizeDiaxxx+/-xxxmil,butduetotheunevenconductordesign,andgenerallyweneedtocompensateaboutxxxmilforHALsurfacefinal（seefigxx）,sowecan’tmeetthematthesametime.
Suggestion:
a）Justcontrolfinishedholediameter&tol,andignoretherequirementofdrillbitsize&Tol.
b）Ifcustomerinsistonit,wehavetoorderspecialdrillbit,pleasereconsidercost（Onlyundertheconditionthatcustomerstronglyrequireitandit’sfeasible,usuallywedon’traisethesuggestion）.
6.Overlappedhole
Question6:
DiaxxxmilholeisoverlappedwithanothersmallDiaxxxmilhole.
Suggestion:
a）We’lldeletethesmallhole.
b）Pleaseadvise.
7.Tooclosebetweenholetoboardedge
Question7:
Thedistancefromholeedgetoboardedgeisveryclose（onlyxxxmil）.
Suggestion:
a）FollowCADtodo,butafterbuildingprofile,theholewillbroken.
b）We’llmovetheholetowardunitaboutxxxmiltoavoidbroken.
（orproposetochangeholesize;iftheholeisPTH,needtoconsiderannularring）
8.Holequantity
Question8:
MismatchedholequalitybetweenxxxincustomerholechartandxxxinCADdrilllayer（seefigxx）.
Suggestion:
FollowCADdrilllayertodo.
9.HolelocationTol
Question9:
Thepositiontolerance+/-xxxmilofholepositionisrequiredincustomerDWG,butduetoregristrationdeviationduringdrilling&D/Fprocess,it’sverytight.（seefigxx）.
Suggestion:
Tosmoothproduction,pleasekindlyrelaxitto+/-xxxmil.
10.Positionofstamphole
Question10:
Accordingtocustomerdesignstampholes,it’sveryclosetoconductorpattern,it’llcauseexposedGNDcopper/line（seefigxx）.
Suggestion:
a）We’llshaveGNDcopperaboutxxxmil/movelineaboutxxxmiltoavo
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